Latest PCB (Printed Circuit Board) News | Page 102

MacDermid Alpha will be highlighting their latest research on final finishes, lightweight bio-based polymers, solder alloy reliability for automotive applications, and brand-new findings from test data on conformal coatings. The four separate technical presentations will take place at this year&rsqu... Read More

Peters, a leading manufacturer of soldering materials, has announced the release of its latest product: Elpemer solder resist SD 2463 FLEX-HF. This high-quality resist is designed for use on flexible electronic circuit carriers, such as rigid-flex and semi-flex PCBs. Available in transparent green a... Read More

Taiyo Circuit Automation announced a new partnership with Shur-Loc Fabric System. This partnership will combine Taiyo Circuit Automation's world-renowned solder mask equipment with Shur-Loc’s unique screen-making system.The benefits of this unique system:• Enables express replacement ... Read More

NVIDIA and Hon Hai Technology Group (Foxconn), the world’s largest technology manufacturer, announced a strategic partnership to develop automated and autonomous vehicle platforms.As part of the agreement, Foxconn will be a tier-one manufacturer, producing electronic control units (ECUs) based... Read More

The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS) that will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California. The Wafer-Level Packaging Symposium will bring together the semiconductor industry’s most respected ... Read More

Koh Young Technology, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 24-2... Read More

Firan Technology Group Corporation, a leading provider of electronic products and avionic sub-systems for the aerospace and defense markets, announced it has entered into an agreement to acquire Holaday Circuits. Holaday is based in Minnetonka, Minnesota, a suburb of Minneapolis. Holaday is a manufa... Read More

Indium Corporation has added SiPaste® C201HF to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components. SiPaste® C201HF combines superior, indust... Read More

Research And Markets have added the "Research Report on Southeast Asia Printed Circuit Board Industry 2023-2032" report to their offering. Printed Circuit Board is the carrier of the electrical connection of electronic components and is an important component of cell phone parts. At presen... Read More

Rehm Thermal Systems in Blaubeuren recently conducted a highly successful seminar on the topic of electronics assembly. In particular, the seminar “Protecting electronics from A to Z” attracted a lot of attention. Attendees had the opportunity to learn from industry experts and gain valu... Read More

BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the appointment of Assembly Resource as its new exclusive distributor for reflow soldering systems in Northern California and Northern Nevada.Leigh Jackson and the team ... Read More

Research and Market have added the "Global Flexible Electronics Market Research and Forecast 2022-2028" report to their offering. According to this report, the global flexible electronics market is anticipated to grow at a significant CAGR of 15.8% during the forecast period.The Report Cov... Read More

DarwinAI, an innovative Industry 4.0 company that is transforming manufacturing by instilling trust in Artificial Intelligence (AI), announced a $6M USD investment round led by BDC Capital’s Deep Tech Venture Fund with participation from new and existing investors. The investment extends the c... Read More

Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting it's latest high-speed, premium accuracy in-line inspection solutions at the 37th NEPCON JAPAN in Tokyo, Japan. From January 25 – 27, visitors are invited to chat with the Sa... Read More

Specialty Coating Systems’ (SCS) Indianapolis coating facility has achieved Nadcap accreditation for conformal coating of electronics–printed board assemblies, demonstrating their continued commitment to quality. The Nadcap audit, conducted by industry experts, is a rigorous technic... Read More

Research and Markets have released the report titled "Global Multilayer Printed Circuits Market Size, Segments, Outlook, and Revenue Forecast 2022-2028”. According to this report, the global Multilayer Printed Circuits Market is expected to grow at a rate of about 5% CAGR over the next si... Read More

Cicor Group has announced the acquisition of the thin film business of AFT Microwave of Backnang, Germany in an asset deal. With this acquisition, Cicor strengthens its position as a leading supplier of thin film substrates in the European market.AFT microwave (AFT) has found a reliable partner for ... Read More

Ventec expands its tec-speed 20.0 range of hydrocarbon-based PCB materials with the new tec-speed 20.0 VTM1000i hydrocarbon laminate. tec-speed 20.0 VTM1000i will debut at the IPC APEX Expo 2023 in San Diego at booth 419 from 24-26 January.Offering impressive thermal reliability and exceptionally hi... Read More

EFFECT Photonics, a leading developer of highly integrated optical solutions, announced that it had selected Fabrinet as its manufacturing partner for its integrated optical sub-assemblies.Fabrinet is a global leader in high-precision optical, electronic, and mechanical manufacturing services, and a... Read More

Zuken, a global leader in the area of software and solutions for electronic and electrical engineering, and Compound Semiconductor Applications (CSA) Catapult have announced an important milestone in their R&D collaboration aimed at building a development environment for state-of-the-art compoun... Read More