Molex, a leading global electronics leader and connectivity innovator, has announced the release of its NearStack PCIe Connector System and Cable Assemblies for next-gen servers. Developed in collaboration with members of the Open Compute Project (OCP), NearStack PCIe replaces traditional paddle-car... Read More
According to a Comprehensive Research Report by Market Research Future (MRFR), “Copper Foil Market Information by Product, Form, Category, Distribution Channel, and Region - Forecast till 2030”, the market is estimated to grow at a 10.31% CAGR to reach USD 17,321.8 Million by 2030. ... Read More
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Europa 2022, scheduled to take place November 15-18, 2022 at the Messe Munchen in Munich, Germany. The company will feature its next-generation WaferSense&r... Read More
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission are gathering in Washington, D.C. this week to discuss "the next big thing" in CHIPS Act implementation: expanding "advanced packaging"... Read More
Space Tech Expo Europe 2022, now in its fifth year, is scheduled to take place from November 15-17 in Bremen, Germany. It is Europe's largest B2B space event and is focused on manufacturing, designing, testing and engineering services for spacecraft, subsystems and space-qualified components.&nb... Read More
Sanmina Corporation, a leading integrated manufacturing solutions company and Reliance Strategic Business Ventures Limited (RSBVL), a wholly-owned subsidiary of Reliance Industries Limited (RIL), India's largest private sector company, announced they have completed the previously announced joint... Read More
Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see a European Chips Act that would bolster the entire semiconductor ecosystem, including those segments critical to advanced packaging. That’s good news... Read More
ICAPE Group announced that they will present at Electronica 2022, the biggest electronic trade fair in the world from November 15-18 2022. More than 30 sales engineers and technical experts from all over Europe will be meeting customers, prospects, and media in booth Hall A1 booth N°506 and will... Read More
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has released the industry’s first automotive-qualified multilayer varistors (MLVs) equipped with the company’s patented FLEXITERM®... Read More
As Per IPC’s September Global Sentiment of the Electronics Supply Chain Report 81 percent of electronics manufacturers are currently experiencing rising material costs while 74 percent indicate labor costs are on the rise. At the same time, ease of recruitment, profit margins and inventory ava... Read More
KLA Corporation has announced plans to build a new research-and-development (R&D) and manufacturing center for the SPTS division, in Newport, Wales, UK. The new development designed to meet BREEAM standard of sustainability rating of excellent is expected to include a capital investment of more ... Read More
Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new machine doubles the existing in-line reflow oven capacity to meet increasing customer demand for high-volume BGA component re-balling applications. The BGA ... Read More
During the LAUFFER Technology Days, ILFA Managing Director Thomas Michels and LAUFFER Managing Director Christof Lauffer announce a close cooperation, which is sealed with a joint letter of intent. The new investment project, which is part of ILFA’s modernisation offensive, is aimed at a highl... Read More
Henkel announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The material, Loctite Eccobond UF 9000AG, enables advanced silicon (Si) node flip chip integration by providing robust interconnect protection and compa... Read More
Isola Group will showcase advanced circuit materials for smaller circuits with great functionality at the PCB West 2022 Exhibition on Wednesday, October 5, 2022 at the Santa Clara Convention Center in Santa Clara, CA. Isola Group has reserved Booth #312 on the PCB West 2022 exhibition floor. Co... Read More
Cicor Group takes another important step in the implementation of its growth strategy: The production capacities in Thuan An City (Vietnam) are significantly expanded to serve the increased demand of existing and newly acquired customers. As part of its strategy, Cicor has been pursuing organic... Read More
According to Precedence Research, the global printed circuit board market size was accounted at USD 78 billion in 2021 and is predicted to surpass around USD 128 billion by 2030. The report title “Printed Circuit Board Market: Global Industry Analysis, Size, Share, Growth, Trends, Regional Out... Read More
Indium Corporation has earned a Mexico Technology Award for its fast wetting, no-clean cored wire with spatter control technology, CW-818. The award was presented on Wednesday, Sept. 21 at the SMTA Guadalajara Expo and Tech Forum hosted at the Hilton Guadalajara in Jalisco, Mexico. "At Ind... Read More
IPC’s Validation Services program has awarded an IPC-1791, Trusted Electronics Designer Requirements Qualified Manufacturer Listing (QML) to Fralock, located in Valencia, Calif.Following the initial IPC audit, Fralock passed stringent design requirements to optimize product quality, reliabilit... Read More
ICAPE Group, a global technology distributor of printed circuit boards, announced the acquisition of 100% of the shares in LUSODABEL, one of the leading suppliers of PCB solutions in Portugal and Spain.Founded in 1996, LUSODABEL is a Portuguese supplier specialized in prototypes, pre-series and seri... Read More
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