Latest PCB (Printed Circuit Board) News | Page 99

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning, and solderability test equipment, announces that it has published a technical paper describing the suggestion that electronic manufacturers should implement automated selective soldering as opposed to usin... Read More

Indium will showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market, including cutting-edge high-reliability alloys, at productronica China, April 13-15, in Shanghai. Indium Corporation will feature its Rel-ion™ suite of elec... Read More

IPC welcomes the action of U.S. President Joe Biden in issuing a “presidential determination” that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA). IPC, al... Read More

Prototron Circuits' President, Mr. Dave Ryder, has announced the signing of Jack Lorber of Sourcing Specialist to represent his company in the Northeast USA.“We are very glad to have Jack Lorber join the Prototron sales team. His knowledge and experience in sales and sourcing will go a lon... Read More

Tempo Automation announced that it has entered into a definitive agreement to acquire Optimum, Inc. and Optimum Design. By vertically integrating electronic design and manufacturing, Tempo expects to be able to engage with customers even earlier in their product design process, streamlining the hard... Read More

YINCAE announced the release of its new breakthrough product: Thermal Underfill- UF 158A2. It is ideal for use in high-reliability applications where temperature cycling, shock, and vibration can cause damage to electronic components. The product features excellent thermal conductivity and high-temp... Read More

ICAPE presented its sourcing strategy outside China, based on the diversification of supply sources and the development of industrial assets. Sourcing is one of the major strengths developed by ICAPE Group over the years. With a network of Chinese factories composed of more than 80 partners and a lo... Read More

Chemcut announced that it has installed and commissioned multiple wet processing systems at Schweitzer Engineering Laboratories (SEL). The processing systems, including Develop/Etch/Strip (DES), are part of the state-of-the-art equipment operating at the SEL’s new printed circuit board fa... Read More

SMTA Europe announced that the 2023 Electronics in Harsh Environments Conference will take place from 23rd to 25th May in Amsterdam, Netherlands. This global conference is a three-day technical event focused on building reliable electronics used in power electronics and harsh environments.Session to... Read More

DarkPulse, a technology company focused on the manufacture, sale, installation and monitoring of laser sensing systems based on its patented BOTDA dark-pulse sensor technology (the "DarkPulse Technology") announced that the State of Arizona has approved the trade name of DarkPulse Electron... Read More

 Nano Dimension, a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced that it has inaugurated its new European headquarters in Munich, Germany to further ... Read More

Amtech Systems - a manufacturer of capital equipment, including thermal processing, wafer polishing, cleaning and related consumables and services used in fabricating semiconductor devices, such as silicon carbide (SiC), silicon power, and electronic assemblies with a focus on enabling technologies ... Read More

Saki will be exhibiting for the first time at Smart SMT & PCB Assembly 2023 to be held from April 5 to 7, 2023 in Suwon, Korea. Saki’s latest automated inspection solutions for SMT processes that contribute to the realization of Smart Factories will be exhibited on Booth #I 102.Show v... Read More

Celera Motion announced the launch of Summit Designer, an innovative new tool that delivers standard, market-ready PCB designs for robotic applications that save significant cost, work and time to market. This tool world’s first platform to simplify PCB design work for Robotic Solutions.Summit... Read More

American Standard Circuits has attained its ISO 13485:2016 medical certification. ISO 13485:2016 specifies requirements for a quality management system where an organization needs to demonstrate its ability to provide medical devices and related services that consistently meet customer and applicabl... Read More

Ventec International has been awarded an IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards Qualified Products Listing (QPL) by IPC's Validation Services Program. Ventec International Group provides high-reliability printed circuit board (PCB) base materials for d... Read More

TTM announced that it has signed a definitive agreement to sell its Shanghai Backplane Assembly (“BPA”) for approximately $11.8 million, subject to customary post-closing adjustments, to DBG Holdings Limited (“DBG”), which is wholly owned by DBG Technology. This transaction i... Read More

AIM announced the release of its newest no clean, halogen-free solder paste, H10. H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste.H10 solder paste is capable of transfer efficiency >... Read More

Indium will feature its innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 13 - 16, in Fountain Hills, AZ.Indium's prov... Read More

Indium Corporation will feature an array of innovative thermal management solutions at SEMI-THERM, March 13-17, in San Jose, CA. Indium's new line of innovative liquid metal pastes (LMP) has enabled a true liquid metal-based TIM solution capable of handling heat dissipation issues while maintain... Read More