Altus Group has supported Cambertronics in upgrading its surface-mount technology (SMT) production capabilities with the installation of a Koh Young solder paste inspection (SPI) system. The investment comes as Cambertronics approaches its 35th anniversary in 2026 and continues to focus on process q... Read More
Indium Corporation announced that its technical experts will deliver presentations on soldering processes and sinter material selection at NEPCON Japan 2026. The 40th-anniversary conference will be held in Tokyo, Japan, from January 21 to 23, 2026, and will focus on research, development, and manufa... Read More
Nordson Electronics Solutions announced that Kamstrup, a provider of intelligent metering solutions headquartered in Skanderborg, Denmark, has increased production throughput by 20% and reclaimed 6 meters (19.7 feet) of factory floor space by upgrading its through-hole technology (THT) production li... Read More
PCB Directory has been featuring a wide range of innovative products introduced by leading companies in the printed circuit board (PCB) industry. In this article, we have compiled a list of top PCB equipment that gained significant attention on the website in 2025. The product categories covered inc... Read More
Yamaha Motor Co., Ltd. announced that it will launch the new YRH10W hybrid placer on March 1. The YRH10W combines the functions of a surface mounter for mounting electronic components onto printed circuit boards and a die bonder for handling semiconductor chips.The YRH10W is a wide-type model based ... Read More
Nordson Electronics Solutions, a global provider of electronics manufacturing technologies, announced that Kamstrup has increased production throughput by 20% and reclaimed 6 meters (19.7 ft) of factory floor space by upgrading its through-hole technology (THT) production line with the Nordson SELEC... Read More
Sono-Tek has introduced SelectaFlux 3, its latest selective ultrasonic flux spray system engineered to bring greater precision and consistency to selective soldering operations. Designed specifically for controlled flux application in selective solder machine environments, SelectaFlux 3 uses ultraso... Read More
Apollo Seiko, a provider of soldering technology and automation solutions, will showcase its largest presence to date at APEX, exhibiting at Booth 1300 with a 30×40-ft display focused on next-generation selective soldering systems and advanced automation. The booth will feature three selective... Read More
Federal Electronics, a provider of electronic manufacturing services, has expanded its production capabilities with the installation of a Mycronic MyPro S30 stencil printer at its Hermosillo facility. This new system enhances the company’s latest SMT line, adding speed, precision, and process ... Read More
Garner Osborne uses Tannlin foils to manufacture its PCB stencils in a VectorGuard™ format, which are compatible with the DEK VectorGuard™ frame system developed by Tannlin. These foils allow them to reduce stencil costs significantly - with a reduction of around 25% for standard stencil... Read More
Indium Corporation has announced the global release of SiPaste® C312HF, a halogen-free, cleanable solder paste engineered for ultra-fine-feature printing in advanced semiconductor and system-in-package (SiP) applications. Formulated with Type 7 powder and supporting aperture sizes as small as 60... Read More
PCBAIR has announced the launch of its advanced 8-layer glass core PCB manufacturing capabilities, integrating proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL). The new glass substrate platform delivers superior signal integrity and thermal stability, addre... Read More
Calumet Electronics has built one of America’s most advanced high-density interconnect (HDI) and High Density Buildup (HBDU) factories. Significant capital investments in equipment were made and brought online for the HDI capacity to be operational through 2025. New equipment began arriving at... Read More
Although aluminum offers lower weight and significantly lower cost than copper, conductor tracks on circuit boards have remained almost exclusively copper-based due to aluminum’s extremely limited solderability. Plasma Innovations now reports that it has overcome this longstanding barrier.Usin... Read More
Benchmark Electronics Inc.'s facility is designed for the rapid development and production of mixed and hybrid systems. Mixed technology modules are a key tool for achieving SWaP goals in high-reliability systems. Benchmark makes bringing these designs to reality easy and efficient by combining ... Read More
Precision PCB Services Inc. offers a full line of high-tech PCB rework & repair services to assist contract manufacturers and product research, and developers. Specializing in quick turnaround times to help get the customer’s product to market on time.Common PCB rework and repairs include:... Read More
With the new VERSAFLOW FIVE, Kurtz Ersa presented the new benchmark in high-end selective soldering at productronica 2025. Having been developed for the most demanding industries, from automotive and aerospace to industrial electronics, it offers an unprecedented combination of throughput, process r... Read More
Essemtec, a global leader in adaptive and highly flexible surface mount technology (SMT) solutions, announced that its Tarantula Dual Lane dispensing and jetting platform has won a 2025 Global Technology Award in the Dispensing Equipment category. The award was presented during a ceremony at product... Read More
Bold Laser Automation has announced its new LASR2424F Laser Automated Solder Reflow System, engineered for high-precision, automated solder reflow of flat and semi-chambered substrates. Designed and manufactured at the company’s New Hampshire facility, the LASR2424F represents a significant ad... Read More
ESCATEC Electronics Sdn Bhd (EEM), the Penang-based business unit of the electronics manufacturing services provider, has installed an advanced Ersa POWERFLOW ULTRA wave soldering system to expand its production capacity for customers developing complex high-tech products. The system underwent sever... Read More
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