As computational demands for artificial intelligence models continue to rise, thermal management has emerged as a key physical constraint for high-performance hardware. Addressing this challenge, PCBAIR, a PCB manufacturing and assembly provider, today announced significant upgrades to its heavy-cop... Read More
Standard FR-4 PCBs and conventional MCPCBs often degrade radio signals by introducing noise and electromagnetic interference (EMI). To solve this issue, COFAN developed the Ultra-RF Ceramic MCPCB™, an advanced metal-core printed circuit board designed for high-frequency and high-power RF appli... Read More
Amber Enterprises India Ltd. has announced the completion of the acquisition of a majority stake in Pune-based Shogini Technoarts Pvt. Ltd. for Rs 506 crore. Following the transaction, Shogini has become a subsidiary of ILJIN Electronics (India) Pvt. Ltd. and a step-down subsidiary of the Amber Grou... Read More
ASC Sunstone Circuits announced a significant enhancement to its Oregon manufacturing facility with the addition of a high-precision via fill machine. As part of a strategic initiative to align manufacturing capabilities across the organization, the equipment has been transitioned from parent compan... Read More
COFAN USA has developed patented Super Pillar™ Technology, a breakthrough in thermal management that delivers superior heat dissipation compared to conventional MCPCBs (Metal Core Printed Circuit Boards). By bypassing the dielectric pre-preg layer, Super Pillar™ creates a direct thermal ... Read More
ASC Sunstone Circuits, a leading provider of high-quality, quick-turn printed circuit boards (PCBs), announced a significant enhancement to its Oregon manufacturing facility. As part of a strategic initiative to align capabilities across the organization, a high-precision via fill machine has been t... Read More
Siemens has announced the acquisition of ASTER Technologies, a provider of printed circuit board assembly (PCBA) test verification and engineering software. The move is aimed at strengthening Siemens’ design-for-test (DFT) capabilities and delivering more integrated solutions for electronics d... Read More
The China-based manufacturer, FR4PCB.TECH, specializing which specializes in small-batch PCBA services, will present its advanced OEM PCB assembly capabilities at CES 2026, the leading international platform for consumer electronics and emerging technologies. The company provides comprehensive OEM a... Read More
Bold Laser Automation announced the release of its new LTX1260A 3D Inspection and Measurement and TMX Profile System, a next-generation solution developed for manufacturers that require fast, high-precision inspection of delicate and critical components. The announcement was made on January 6, 2026,... Read More
Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates.The new line will come online in January and is designed to support high-end FC-BGAs, large-scale, multilayer substrates needed for AI and data center semiconductors.The production ... Read More
KSG offers Iceberg® PCB solutions specifically developed to handle high currents and increased heat dissipation in today’s increasingly powerful electronic systems. By using thick copper structures with mixed copper thicknesses ranging from 105 to 400 µm in the outer layers and ... Read More
With just a month until the doors open, Asia Photonics Expo (APE 2026) is poised to be the defining industry event for photonics and semiconductors in Asia-Pacific and in Singapore. As these technologies converge to power advancements in AI, data centers, quantum computing, and more, APE 2026 o... Read More
Matrix Electronics is executing plans to establish a Distribution Centre in Reiskirchen, Germany. Matrix’s Engineering Team will begin installing automated equipment at the new facility, which is scheduled to be fully operational by April 1, 2026.“Establishing physical infrastructure is ... Read More
Y&T Technology Development Co., LTD., a PCB and PCB assembly manufacturer based in Shenzhen, China, announced continued enhancements to its PCB assembly capabilities through investments in advanced production equipment, testing systems, and manufacturing software. The initiative supports the com... Read More
Photonics Systems Group has introduced the InnoLas DP10X0, a laser depaneling system designed to meet the demands of modern PCB assembly operations. The new system targets manufacturers seeking high throughput, precision cutting, and advanced automation capabilities.The DP10X0 features a working are... Read More
Bittele Electronics has renewed its ISO 9001:2015 certification for its turnkey PCB assembly services. The certification, issued by SGS North America, is valid from January 4, 2026, through January 4, 2029, subject to ongoing surveillance audits.The renewed accreditation covers Bittele’s facil... Read More
Aspocomp provides a wide variety of PCBs with a designed-in cooling feature for high-power components. They allow customers to choose a tailored solution right under the component that leads to heat flow efficiently through the PCB. Aspocomp provides the following PCB cooling technologies:Via farm c... Read More
Keystone Electronics has expanded its test point selection with the introduction of a new miniature SMT test point, featuring a symmetrical flat-wire design that enables efficient and safe PCB testing.This latest “Mini” version enables high-strength, test point-to-PCB bonding, with a min... Read More
Sanmina Corporation, a leading global electronics manufacturing services (EMS) provider, manufactures complex PCBAs for the aerospace and avionics industry. With decades of experience supporting mission-critical systems, Sanmina delivers end-to-end solutions spanning advanced PCB fabrication, c... Read More
Federal Electronics, a provider of electronic manufacturing services, has expanded its production capabilities with the installation of a Mycronic MyPro S30 stencil printer at its Hermosillo facility. This new system enhances the company’s latest SMT line, adding speed, precision, and process ... Read More
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