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PCB Industry Update - 11 Jan 2022

11 Jan 2022 Newsletter - PCB Directory

New products this week. View it in your browser

 
Weekly Edition
Date: 11 Jan 2022
 
Sponsored by Digikey
 
 
Featured Products this Week
AT&S Develops PCBs for High-Frequency Mobile Communication Using Waveguides with Minimal Loss
News
AT&S Develops PCBs for High-Frequency Mobile Communication Using Waveguides with Minimal Loss
What comes after 5G? The Austrian technology company, AT&S makes an important contribution to the development of tomorrow’s mobile communication and radar technologies and is already working on 6G.Modern communication infrastructure has to deal with a steadily growing flood of data. The increasing demand for bandwidth has, among other things, led to the use of ever-higher frequencies in mobile communications. Read More
Position Accuracy Machines for Selective Soldering Fine Pitch Components
Whitepaper
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process window for designers. THT connectors can be soldered on the top and bottom side of boards, board in board, PCBs to metal shields or housing out of plastic or aluminum are today's state of the art.
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Test Product 1
Product
Test Product 1

Automated Optical Inspection (AOI) Equipment  from CyberOptics Corporation

Interfacial stress is the stress that is generated as a result of soldering two different metals together. Different metals have different CTEs (coefficient of thermal expansion) and thus expand and contract by different amounts as the temperature changes. When two different metals are soldered together, changes in temperature can cause one metal to expand more than the.
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Nano Dimension Acquires Global Inkjet Systems
News
Nano Dimension Acquires Global Inkjet Systems
Nano Dimension, an industry leader in Additively Manufactured Electronics (AME)/3D-Printed Electronics (PE), and Micro Additive Manufacturing (Micro-AM) has announced the acquisition of Global Inkjet Systems (GIS).GIS, based in Cambridge, UK, is a leading developer and supplier of high-performance control electronics, software, and ink delivery systems. Read More
Rework stations: Meeting the challenges of lead-free solders
Whitepaper
Rework stations: Meeting the challenges of lead-free solders
Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types.
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Test Product 2
Product
Test Product 2

Wave Soldering Equipment  from Manncorp

Interfacial stress is the stress that is generated as a result of soldering two different metals together. Different metals have different CTEs (coefficient of thermal expansion) and thus expand and contract by different amounts as the temperature changes. When two different metals are soldered together, changes in temperature can cause one metal to expand more than the other.
Product Details
Nano Dimension Sells Another DragonFly IV 3D-AME System To Leading Western Defense Force
News
Nano Dimension Sells Another DragonFly IV 3D-AME System To Leading Western Defense Force
Nano Dimension, an industry-leader in Additively Manufactured Electronics (AME), Printed Electronics (PE), and Micro Additive Manufacturing (Micro-AM), announced that it has sold yet another DragonFly IV 3D-AME Printer and FLIGHT Applications Software package, both first released in mid-November 2021, to a leading Western Defense Force.Nano Dimension is the leading provider of intelligent machines for the fabrication of AME. Read More
PCB WEST 2022
Event
PCB WEST 2022
Date: 4 October, 2022 to 7 October, 2022
Location: California
BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications
Whitepaper
BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a single package has compromised test efficiency and overall package assembly yield. Separation and packaging the semiconductor functions into sections, on the other hand, has proved to be more efficient and, even though two interposers are required, more economical.
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Test
Test
Test Ad for PCB Directory Newsletter
IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain, with nine in 10 electronics manufacturers reporting rising materials costs and more than three-fourths. Click Here
Materials and Labour Cost Remains the Largest Issue in Global Electronics Manufacturing Supply Chain
News
Materials and Labour Cost Remains the Largest Issue in Global Electronics Manufacturing Supply Chain
IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain, with nine in 10 electronics manufacturers reporting rising materials costs and more than three-fourths reporting rising labor costs. Read More
Designing Circuit Boards for Selective Robotic Coating Application
Whitepaper
Designing Circuit Boards for Selective Robotic Coating Application
Designing circuit boards for selective robotic spraying of conformal coating can be straightforward if you follow some design rules. Follow them and you can save money and time in your application process. However, if the rules are not followed, the resultant circuit board design can challenge even the most sophisticated conformal coating system and its operator to achieve the finish desired.
Download White Paper
Test Product 3
Product
Test Product 3

Solder Paste Printer  from Juki Americas

Interfacial stress is the stress that is generated as a result of soldering two different metals together. Different metals have different CTEs (coefficient of thermal expansion) and thus expand and contract by different amounts as the temperature changes. When two different metals are soldered together, changes in temperature can cause one metal to expand more than the other.
Download Brochure  Product Details
Test Product 4
Product
Test Product 4

Solder Paste Mixer  from Seika Machinery, Inc

Interfacial stress is the stress that is generated as a result of soldering two different metals together. Different metals have different CTEs (coefficient of thermal expansion) and thus expand and contract by different amounts as the temperature changes. When two different metals are soldered together, changes in temperature can cause one metal to expand more than the other.
Download Brochure  Product Details
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