| New PCB Equipment |
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| Full 3D AOI System for THT Solder Joints and Pin Inspection | |
Automated Optical Inspection (AOI) Equipment
from MEK Americas LLC
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| The ISO-Spector X1 from MEK is a Full 3D Automatic Optical Inspection (AOI) System that is specifically engineered for THT solder joints and pin inspection. It uses a 10 MP CMOS Camera with a lens of resolution 19 μm and a field-of-view (FOV) of 60 x 60 mm. This AOI system has 3D Volume Measurement, Spectral Histogram Analysis & custom Algorithm image processing capabilities. |
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| AOI Equipment for HDI and Multilayer PCBs | |
Automated Optical Inspection (AOI) Equipment
from CIMS
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| The Galaxy 25μ from CIMS is an AOI Equipment that is designed for the inspection of HDI and high-end multi-layer PCBs. This machine is capable of scanning down to 25 µm with line/space width technology. It uses state-of-the-art Microlight™ Gen II optical technology that provides optimal light coverage to be able to meet the most rigorous detection requirements. This equipment is compatible with front AMHS automation or robots. |
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| AOI Equipment for Conformal Coating Inspection | |
Automated Optical Inspection (AOI) Equipment
from GOPEL Electronic
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| The Multi Line CCI from GOPEL Electronics is an Automatic Optical Inspection (AOI) Equipment that is specially designed for inspection of missing or defective protective conformal coating. It has a telecentric color camera with a resolution of 25 &mum and uses UV + white (top) & UV + red (side) LED for illumination. This machine can perform both wet or dry testing and can inspect both sides of the board in one system. |
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| PCB Conformal Coating Machine with Four Coating Valves | |
Conformal Coating Machine
from Dongguan ICT Technology Co.,Ltd
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| The I.C.T-T650 from Dongguan ICT Technology Co., Ltd. is a Conformal Coating Machine designed for selective PCB conformal coating. It has four coating valves - two atomization valves and two precision valves - to ensure accurate and efficient material deposition for a wide range of board designs. It can accommodate boards of sizes 50x 50 mm to 450 x 460 mm. |
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| Light and Moisture Curable Conformal Coating Material | |
Conformal Coating Materials
from Dymax
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| The 9483 from Dymax is a Light and Moisture Curable Conformal Coating Material that is especially formulated to ensure complete cure for coating that flows underneath components on PCBs. It has a dielectric constant of 3.26 and can withstand a dielectric voltage of up to 59 kV/mm. This material does not contain any nonreactive solvents and has a density of 1.09 g/ml with a glass transition temperature (Tg) of 57 °C. |
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| Single-Sided Flying Probe Test System for Flex and Substrate Boards | |
Flying Probe Tester
from atg - Luther & Maelzer GmbH
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| The S3 from atg - Luther & Maelzer GmbH is a Single-Sided Flying Probe Test System that has 4 test heads. It performs single-sided testing and has a vacuum table for loading of flex and substrate boards. This system has a color camera with a resolution of 1.2 &mum/pixel for optical scanning of the top side and has a test area of 300 x 310 mm. It can handle PCB sizes of up to 330 x 310 mm and PCB thicknesses of 0.05 to 3 mm. |
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| AOI System with AI-driven Probes | |
In-Circuit Tester
from Controlar Test Systems
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| The PicAI from Controlar is an AOI System that uses AI-driven probes for accurate and fast inspection. It uses a system that integrates a dual-sided vision module with adaptive Artificial Intelligence (AI) software to analyze probe marks and verify probe conformity. This system captures the entire PCB to detect punctures at each Test Point (TP), measuring deviations from TP’s center with ~7 μm per pixel accuracy. |
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| X-Ray Inspection System with Microfocus X-Ray Technology | |
X-ray Inspection Equipment
from Manncorp
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| The X6800 from Manncorp is an X-Ray Inspection System that uses a microfocus X-ray technology. This X-ray tube produces a tube voltage of up to 90 kV with a tube current of 200 μA and has a focal spot of size 5 μm. It has a flat-panel detector with an effective area of 130 x 130 mm and has 85 μm pixels with a resolution of 1536 x 1536, delivering a data rate of 20 fps. This equipment can accommodate PCB sizes of up to 530 x 530 mm. |
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| Smart 3D Automated X-Ray Inspection System with AI-Powered Features | |
X-ray Inspection Equipment
from ViTrox Corporation Berhad
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| The V810Ai QX1 from ViTrox is an Automated X-Ray Inspection System that has smart 3D inspection capabilities with AI-powered features for programming, defect detection, and verification. It has a high-speed, precision imaging chain architecture and an ultra-high imaging resolution of up to 2μm with 25X magnification for micro-defect detection down to 10 μm (Flip Chip, SiP, 008004, and miniature electronics, etc.). |
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| Pick and Place Machine with Dispensing Capabilities | |
Pick and Place Machine
from Essemtec AG
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| The Puma4 from Essemtec AG is a Pick and Place Machine that has a placement speed of 30,000 cph. It also has a Shockwave jet valve for dispensing applications after placement with a solder jetting speed of up to 1,100,000 dots/hour. This machine has 4-placement axes with a placement accuracy of up to ± 40 &mum and a feeder capacity of 280 components (160 inline) using an 8 mm tape. |
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| Pick and Place Machine for Component Insertion and Screw Tightening | |
Pick and Place Machine
from Juki
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| The JM-E01 from Juki is a Pick and Place Machine that can insert the components and tighten screws for secure placement. It supports components of diameter up to 150 mm & height up to 90 mm and can accommodate PCB sizes of up to 800 x 560 mm. This machine uses JUKI’s unique 3D image-recognition technique to recognize the leading edge of the lead more accurately. |
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| AI-powered Inspection Platform for PCB Sizes of up to 510 x 310 mm | |
Solder Paste Inspection Equipment
from Test Research, Inc
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| The TR7700Q SII-S DL from Test Research, Inc. (TRI) is an AI-powered 3D Solder Paste Inspection system (3D SEMI AOI) that utilizes advanced Stop-and-Go Imaging technology for precise inspection. It supports PCBs up to 510 × 310 mm in dual-lane mode and 510 × 590 mm in single-lane mode, accommodating board thicknesses from 0.6 to 5 mm and weights up to 3 kg. Its high-precision motion table achieves an X-Y-Z axis resolution of 1 µm, with motion controlled by ballscrew and AC servo systems across all axes. |
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| Vapor Phase Reflow Soldering System for PCB sizes of up to 1500 x 800 mm | |
Reflow Soldering Equipment
from ASSCON Systemtechnik-Elektronik GmbH
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| The VP1000-1580 from ASSCON Systemtechnik-Elektronik GmbH is a Vapor Phase Reflow Soldering System engineered for precise, oxidation-free soldering of large-format PCBs. Designed for efficient single-lane transport, it can handle PCB sizes up to 1500 x 800 mm, components up to 60 mm in height. It supports an oxidation-free pre-heating and soldering process with a continuously adjustable temperature gradient through sensor-based profiling. |
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| Glass-Reinforced PTFE Laminate for Wireless Antennas | |
PCB Laminates
from Rogers Corporation
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| The AD255C laminate from Rogers Corporation is a Glass-Reinforced PTFE Laminate that is specifically engineered to meet the demands of wireless antenna markets. It has a dielectric constant (Dk) of 2.55 and a dissipation factor of 0.0013 at 10 GHz. This laminate has a dielectric strength of 911 V/mil and a PIM of –159/-163 dBc. It has a Td of less than 500 °C and a moisture absorption of 0.03%. |
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| Selective Soldering Machine with Segmented Matrix Heater | |
Selective Soldering Machine
from Kurtz Ersa
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| The Versaflow Five from kurtz ersa is a Selective Soldering Machine that enables the processing of one XL board or 2x standard formats. It has a matrix heater that consists of several segments that can be controlled individually. This enables targeted and homogeneous heating of the assemblies, even with complex boards and the segmented structure allows up to six different heating surfaces to be mapped, enabling precise adaptation to the specific requirements of the PCBs. |
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| Solder Paste Inspection Equipment with MRS sensor Technology | |
Solder Paste Inspection Equipment
from Nordson Corporation
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| The SE3000 from Nordson Corporation is a Solder Paste Inspection (SPI) system based on Multi-Reflection Suppression (MRS) sensor technology. It features a Dual Mode MRS189 inspection sensor supporting both high-resolution and high-speed modes, with selectable resolutions of 9 µm for detailed analysis and 18 µm for faster processing. In high-resolution mode, the system inspects at speeds up to 16 cm²/sec. |
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| Wave Soldering Equipment for PCB Widths of up to 457 mm | |
Wave Soldering Equipment
from ITW EAE
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| The VectraES (VES3) from ITW EAE is a Wave Soldering Equipment that supports PCB widths of up to 457 mm. It uses UltraFill™ with FloLift™ nozzles for improved hole fill, reduced bridging, and minimized dross generation suitable for lead-free and demanding soldering processes. This equipment includes options for ServoSpray™, ServoJet™, and ServoSonic™ fluxing systems, along with foam fluxing as standard. |
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| Air-Reflow No-Clean Solder Paste for Long Solder Reflow Processes | |
Solder Paste
from Indium Corporation
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| The Indium8.9HFT from Indium Corporation is an Air-Reflow No-Clean Solder Paste that has Indalloy® 292, Indalloy® 276, Indalloy® 259, Indalloy® 133, and Indalloy® 264 alloys. It has a metal content of 88.5% and is specially formulated for higher processing temperatures required by high-reliability alloy Indalloy® 292 and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. |
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