| Top PCB Equipment of 2025 |
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| AOI Equipment for large Format PCB Sizes of up to 510 x 460 mm | |
Automated Optical Inspection (AOI) Equipment
from Manncorp
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| The Sherlock 500LA from Manncorp is an Automated Optical Inspection (AOI) Machine that is designed for high-speed inspection of large format PCBs. It can handle PCB sizes from 50 x 50 mm to 510 x 460 mm and a board thickness range of 0.3 to 4 mm. This AOI system uses a 4-megapixel camera that supports resolutions of 8.7, 13.7, and 18.7 µm/pixel for flexible coverage of component sizes down to 01005 in size. |
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| AOI System for inspecting PCBs measuring up to 490 x 510 mm | |
Automated Optical Inspection (AOI) Equipment
from ViTrox Corporation Berhad
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| The V510i Optimus 3D Advanced from ViTrox Corporation Berhad is an Automated Optical Inspection (AOI) System for advanced packaging and microelectronics. It is designed for inspecting PCBs measuring from 50 x 50 mm to 490 x 510 mm (0.2 to 4 mm in thickness). This system employs a 12-megapixel camera with a field of view of 40 x 30 mm that produces images with a resolution of 10µm. |
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| 3D/2D AOI Equipment for PCB Sizes of up to 620 x 510 mm | |
Automated Optical Inspection (AOI) Equipment
from GOPEL Electronic
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| The Multi Line AOI from GOPEL Electronic is a 3D AOI equipment designed for the inspection of THT components, THT solder joints and SMD components. It uses 3D and 2D inspection technology with 3D/2D orthogonal camera modules with telecentric optics and 3D image capturing sensors (for 3D inspection) or 4/8 angled-view camera modules (for 2D inspection with angled-view). This equipment has a resolution of 15 µm for 3D inspection and 25 µm (orthogonal) & 35 µm (angled view) for 2D inspection. |
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| Pick and Place Machine with a Placement Speed of 22,000 CPH | |
Pick and Place Machine
from Hanwha Precision Machinery
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| The HM520W HP from Hanwha Precision Machinery is a Pick and Place Machine that has 8 spindles and 2 gantries. It has a placement speed of 22,000 CPH and a placement accuracy of ±40 μm for chip components and ±20 μm for ICs. This machine accommodates component sizes ranging from 0603 to 150 x 74 mm, making it ideal for a wide range of components. It supports quick replacement of heads and allows configuration with different types of heads at both front and rear. |
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| Fully Automated Pick and Place Machine for PCB Sizes of up to 760 x 687 mm | |
Pick and Place Machine
from Panasonic Corporation
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| The NPM-GW from Panasonic Corporation is a Pick and Place Machine that can accommodate PCB sizes of up to 760 x 687 mm. It supports multiple placement heads, including FC16, FC08, and FC03, and has a placement speed of up to 52000 cph (FC16), 26500 cph (FC08), or 10000 cph (FC03). These placement heads have a placement accuracy of ±25 μm and support component sizes ranging from 0201 chip to 10 x 10 x 6 mm (FC16), 0402 chip to 100 x 40 x 12 (FC08) & 0603 chip to 135 x 135 x 18 mm. |
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| Sponsored by Embedded World 2026 | | | |
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| SMT Pick-and-Place Machine with Placement Area of up to 320 x 270 mm | |
Pick and Place Machine
from Autotronik SMT-GmbH
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| The BS281E-V from Autotronik SMT-GmbH is a Pick and Place Machine that has a single head with Vision on the Fly technology. It can accommodate up to 64 belt feeders and supports an 8 mm-wide belt. This machine has a Quick Scan function and the capacity for up to three waffle trays for IC component placement. It has a placement area of 320 x 415 mm without a waffle tray and 320 x 270 mm with a waffle tray. |
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| 6 Probe Flying Probe Tester with Inspection Area of 540 x 483 mm | |
Flying Probe Tester
from Takaya Corp.
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| The APT-2600FD from Takaya Corp. is a Flying Probe Tester that has 6 probes - 4 top and 2 bottom. It has a measurement speed of 0.02 s/step and up to 350,000 test steps. This flying probe tester has an inspection area of 540 x 483 mm and uses a CMOS color camera with a liquid lens that significantly improves the resolution and depth of the subject. It is compatible with OCR (character recognition) to improve work efficiency and supports a "3D Real Map Function" that realizes intuitive operation by displaying and visualizing the probe contact position in three dimensions. |
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| 3D Solder Paste Inspection Equipment for PCB Sizes of up to 510 x 510 mm | |
Solder Paste Inspection Equipment
from MEK Americas LLC
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| The ISO-Spector S30 from Mek Americas LLC is a 3D Solder Paste Inspection Equipment. It has a CMOS Mono Camera that operates on phase shift & hybrid inspection principles and is also equipped with a 2D ring light & a 3D projector. This outline of the solder paste is extracted through the use of the 360-degree ring light that projects against inspection objects (solder paste). It isolates solder paste on the PCB and performs 3D measurements to achieve more reliable inspections. |
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| Dual-Panel In-Circuit Tester for High-Speed Parallel Testing | |
In-Circuit Tester
from CheckSum, LLC
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| The ILS-X2 from CheckSum is an In-Circuit Tester (ICT) that supports the complete suite of CheckSum’s Parallel Test, including ICT, ISP, and PFT (Parallel Functional Testing). It can support up to two panels simultaneously in a single fixture and has top and bottom probing. This tester has automatic width adjustment and a PCB probe area of up to 24 x 13.2 inches. It can support a maximum component height of up to 3.325 inches (top) & 2.92 inches (bottom) and a PCB thickness of more than 0.8 mm. This tester supports flexible automated touchless tests with support for in-line or off-line operations. |
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| 3D CT X-ray Inspection System for PCB sizes of up to 950 x 530 mm | |
X-ray Inspection Equipment
from Test Research, Inc
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| The TR7600HP from Test Research, Inc. is an X-ray Inspection System that uses 2D, 2.5D, 3D Slicing, and Planar CT (Optional) inspection methods. It uses an X-ray source with an excitation voltage range of 40 to 180 kV and a flat panel detector camera providing a resolution of 7 µm to 30 µm. This equipment is equipped with high-precision ballscrews and AC-servo controllers for X, Y, and Z-axis controls. It can accommodate PCBs of sizes up to 950 x 530 mm and a PCB thickness of 0.4 to 7 mm. |
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| Sponsored by Embedded World 2026 | | |
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| Reflow Soldering Equipment with Horizontal Convection Heating Technology | |
Reflow Soldering Equipment
from DDM Novastar Inc
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| The GF-125 HC/HT from DDM Novastar is a Reflow Soldering System with a heated tunnel length of 1423 mm. It uses Horizontal Convection Heating Technology and has 5 heating zones, top and bottom, each of which supports temperatures up to 400 °C and 1 cooling zone. This oven can accommodate PCB sizes of 304 x 35 mm with a 12-inch wide low-mass stainless steel mesh belt conveyor, for stable board transport and even heat exposure. It has programmable control of conveyor speed, heating elements, 10 cyclonic air generators, and two cooling fans. |
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| Selective Soldering Machine with Segmented Matrix Heater | |
Selective Soldering Machine
from Kurtz Ersa
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| The Versaflow Five from kurtz ersa is a Selective Soldering Machine that enables the processing of one XL board or 2x standard formats. It has a matrix heater that consists of several segments that can be controlled individually. This enables targeted and homogeneous heating of the assemblies, even with complex boards and the segmented structure allows up to six different heating surfaces to be mapped, enabling precise adaptation to the specific requirements of the PCBs. This machine supports a solder wave height of up to 5 mm and achieves soldering temperatures of up to 320 °C. |
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| Conformal Coating Machines with Dual-Valve Dispensing System | |
Conformal Coating Machine
from Nordson Corporation
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| The ASYMTEK Forte® Series from Nordson Corporation are Conformal Coating Machines that use Dual IntelliJet® valve-compatible, cutting-edge dispensing technology. They use a Forte MAX dual-valve system that can dispense in two modes - a dual-simultaneous mode that dispenses a single fluid type from two identical valves and a dual-action mode that allows independent, sequential dispensing of two fluid types from separate valves. These machines have a dispense area of 342 x 407 mm (single valve) and 386 x 396 mm (dual valve). |
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| Automatic Solder Paste Printer for PCB Sizes of up to 510 x 510 mm | |
Solder Paste Printer
from Yamaha Motor Co., Ltd
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| The YRP10e from Yamaha Motor is an Automatic Solder Paste Printer that has Yamaha's attack angle variable 3S printing head. It has a printing accuracy of ±30 µm and allows for precise control of squeegee angle, pressure, and speed, suitable for different solder types and stencil conditions. This printer can accommodate board sizes ranging from 50 x 50 mm to 510 x 510 mm and supports 750 x 750, 750 x 650, 736 x 736, 650 x 550, 600 x 550, 600 x 550, 584 x 584, and 550 x 650 stencil frame sizes. |
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| Loader/Unloader with Combined Peeling & Loading Functions | |
Loader/Unloader
from Advanced Engineering
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| The PAL101 from Advanced Engineering is a Loader/Unloader that can process up to 6 PCB panels per minute. It is based on AE’s proven peeling technology that carries out high-precision peeling for reliable, efficient processing. This machine is powered by the precision of the SERVANT robot with integrated centering that delivers a fully automated, space-saving start to the production line. |
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| Air-Reflow No-Clean Solder Paste for Long Solder Reflow Processes | |
Solder Paste
from Indium Corporation
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| The Indium8.9HFT from Indium Corporation is an Air-Reflow No-Clean Solder Paste that has Indalloy® 292, Indalloy® 276, Indalloy® 259, Indalloy® 133, and Indalloy® 264 alloys. It has a metal content of 88.5% and is specially formulated for higher processing temperatures required by high-reliability alloy Indalloy® 292 and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. |
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| Rosin-based, No-Clean, Lead-Free Solder Wire for THT and SMT Soldering | |
Solder Wire
from FCT Solder
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| The NC601 from FCT Solder is a Rosin-Based, No-Clean, Lead-Free Solder Wire that is made of SN100C and SAC305 solder alloys. It is available in diameters of 0.015 to 0.125 inches (SN100C) and 0.020, 0.032, or 0.062 inches (SAC305) with a flux content of 2-3% by weight. This solder wire has a unique flux formulation that produces a clear, colorless residue while providing good low smoke and mild odor. |
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| Heat-Resistant, Ultra-Low Loss Multi-Layer PCB Laminate Material | |
PCB Laminates
from Panasonic Corporation
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| The R-579Y from Panasonic is a Multilayer PCB Laminate Material that is designed to have ultra-low transmission loss and be highly heat-resistant. It has a glass transition temperature of 220°C and a thermal decomposition temperature of 370°C. This laminate material has a CTE ranging from 17-20 ppm/°C for the X & Y axes and 50 to 270 ppm/°C for the Z-axis as per IPC-TM-650 2.4.24 specifications. It is available in two variants - R-579Y(N) Low-Dk glass with a dielectric constant (Dk) of 3.13 & a dissipation factor (Df) of 0.0016 and R-579Y(U) Ultra Low-Df glass with a Dk of 3.08 & a Df of 0.0012. |
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