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01 Jan, 2026 Newsletter - PCB Directory

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PCB Insights
Date: 01 Jan, 2026
 
Sponsored by EMC Directory
 
 
Latest News
News
Graphite Core PCBs from Teledyne Labtech Offer Superior Thermal Conductivity for Modern Electronic Devices

Teledyne Labtech
News
Innovative Semi-Additive Process Technology from GS Supports PCB Line Spacing Down to 10 microns

GS Swiss PCB AG
News
Celus and AGS Devices Partner to Simplify Electronics Design and Procurement Workflows

Celus
News
Matrix Electronics Strengthens European Presence with New Distribution Centre in Germany

Matrix USA Inc
News
Photonics Systems Group Introduces New Laser Depaneling System for Modern PCB Assemblies

Photonics Systems Group
News
Sanmina Corporation Manufactures Complex Avionics PCBAs Compliant with AS9100 Standards

Sanmina Corporation
News
From Multilayer to UHDI: Winonics’ Advanced PCB Manufacturing Capabilities

Winonics, Inc
News
Keystone Electronics Introduces New Miniature SMT Test Point for High-Density PCB Testing

Keystone Electronics
News
Federal Electronics Enhances SMT Operations with Installtion of New Stencil Printer from Mycronics

Federal Electronics
News
TPCA and ITRI Reports Highlight How AI Is Reshaping the PCB Industry Across China, Japan, and South Korea

TPCA
News
Starteam Global Launches high-density interconnect (HDI) Production Line at Jiangyou Facility

Starteam Global
News
SABIC Announces Expansion of PPE Oligomer Production Capacity to Support AI and 5G Data Center Demands

SABIC
News
Summit Interconnect Designs & Manufactures Advanced High-Performance RF and Microwave PCBs

Summit Interconnect
News
Indium Corporation Introduces New Halogen-Free Solder Paste Designed for Ultra-Fine-Feature Printing

Indium Corporation
News
Fineline Manufactures Automatic Test Equipment (ATE) PCBs for use in Avionics, Automotive, and Military Sectors

FINELINE Ltd
News
Plasma Innovations Develops Method to Manufacture and Solder Aluminum Conductor Tracks for Lightweight PCBs

Plasma Innovations
News
Sheldahl Manufactures Flexible Transparent Circuits for Customizable Interface Solutions

Sheldahl Corporation
News
NanoFlowX Partners with Bentec to Expand Advanced PCB Protection Across Europe and India

NanoFlowX
News
Precision PCB Services Offers High-Tech PCB Rework & Repair Services

Precision PCB Services
News
Siber Circuits Provides Automotive PCB Fabrication & Prototyping Services

Siber Circuits inc.
News
Benchmark Provides Expertise in Rapid Development and Production of Mixed and Hybrid Systems

Benchmark Electronics Inc
News
Syrma SGS Begins Construction of New Advanced PCB Facility in Andhra Pradesh

Syrma SGS Technology Pvt. Ltd
New White Papers & Articles
Impact of Conformal Coating Material on the Reliability of Thinner Wirewound CMC Inductors - BOURNS
IPC-A-610 Standard Compliance by using Advanced AI Technology - Cybord
How PCB designers can use IPC specifications for DFM - Siemens
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PCB Directory is the largest global directory of PCB assembly (PCBA) service providers. It enables users to filter printed circuit board assembly companies by country, state, and technical capabilities such as order type (prototype or production) and assembly type (mixed, surface mount, or through-hole) and others. Click here to learn more.
Featured Products
Depaneling Equipment
Dual-head Laser Depaneling System for Rigid and Flexible PCBs
Depaneling Equipment  from Photonics Systems Group
The DP10x0 from Photonics Systems Group is a Laser Depaneling System that has up to 2 laser heads. It has a high-power laser source that produces a laser of wavelength 532 nm for high throughput and clean, residue-free cuts. This equipment has a high-performance galvo scanner for beam delivery, an integrated vision system for automatic alignment and positioning, and a built-in automatic laser power meter for real-time process monitoring and calibration.
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Selective Soldering Machine
Selective Soldering Combo Machine with a Working Area of 500 x 400 mm
Selective Soldering Machine  from Apollo Seiko
The AF 4050 A from Apollo Seiko is a Selective Soldering Combo Machine designed to conduct soldering operation over a working area of 500 x 400 mm. It consists of an automatic nozzle cleaner, automatic solder feeder, solder level and laser type flux detection (option) sensors, position calibration camera, an IR pre-heater, and a purity check unit. This machine has a built-in unit that adjusts the temperature of the solder pot by measuring the temperature of the tip of the nozzle.
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Solder Paste
Solder Paste for Fine-Aperture Printing Applications
Solder Paste  from Indium Corporation
The SiPaste® C312HF from Indium Corporation is a Halogen-Free Solder Paste that is formulated for fine-aperture printing applications. It is based on a 96.5Sn/3.0Ag/0.5Cu (SAC305) and 99.3Sn/0.7Cu alloys with a metal load of 87–89%. This solder paste exhibits optimum transfer efficiency with consistent printing stability after continuous use, a long stencil life of at least 4 hours without dry-out, and a benign, non-corrosive residue that can remain post-reflow without cleaning.
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X-ray Inspection Equipment
Coating Measurement Systems for High-Precision Imaging and Bottom-Up Inspection
X-ray Inspection Equipment  from Bowman XRF
The G Series from Bowman XRF are Coating Measurement Systems designed to provide bottom-up inspection and high-precision video imaging of samples in a limited benchtop space. They consist of a micro-focus X-ray tube, a fixed collimator, a fixed focus camera, a silicon solid-state detector. These systems combine motorized Z-axis and laser-based auto focus capabilities with an optional manual XY stage that covers a sample area of 1.5 x 1.5 inches, allowing for easy positioning of small and large parts.
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Solder Paste Printer
Manual Solder Paste Printer for Rigid and Flexible PCBs
Solder Paste Printer  from Asys Group Americas Inc
The SERIO XM from Asys Group Americas Inc. is a Solder Paste Printer that can print on flexible as well as rigid PCB materials including glass, ceramic or metal up to a thickness of 30 mm. It has a print format of up to 350 x 450 mm with a material thickness of up to 30 mm and has an alignment accuracy of ±10 µm. This machine is a manual screen and stencil printer dedicated to small batch size production and prototyping purposes.
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Wave Soldering Equipment
Wave Soldering Machine with a 3-Zone Hot Air Preheater
Wave Soldering Equipment  from Advanced Mechatronics Solutions, Inc
The HW 450 from Advanced Mechatronics Solutions, Inc. is a Wave Soldering Machine that has a three-zone hot air preheater of length 1800 mm. It has dual, high-performance, high-temperature motors that pump the molten solder through a titanium-alloy recirculating system and wave nozzles that are specially designed to minimize solder oxidation. Both motors include transducer-controlled flow adjustment to ensure precise wave height and uniformity.
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Pick and Place Machine
Automated Pick and Place Machine with Placement Speed of 24,000 CPH
Pick and Place Machine  from Mycronic AB
The MYPro A41SX from Mycronic is an Automated Pick and Place Machine that has a placement speed of up to 24,000 CPH. It supports two types of mounting heads - a MIDAS mounthead that supports component sizes from 03015 (0.3 x 0.15 mm) to 99 x 73 x 15 mm, or an MX7 mounthead that supports component sizes from 01005 (0.1 x 0.05 mm) to 45 x 45 x 15 mm or as long as 150 x 40 x 15 mm.
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Automated Optical Inspection (AOI) Equipment
3D AOI System for Advanced Packaging and Reflective Components
Automated Optical Inspection (AOI) Equipment  from ViTrox Corporation Berhad
The V510i from ViTrox is a Automated Optical Inspection (AOI) equipment that performs high accuracy 3D inspection for advanced packaging (lead frame inspection, die, and wire bond inspection) and mirror/reflective components. It uses Phase Shift Profilometry (PSP) Methodology with 4-way projectors for true 3D inspection. This AOI system has a 25 MP CoaXPress camera with a telecentric lens of resolution from 2.5 µm to 9 µm that provides a FOV of up to 44.2 x 44.3 mm and an inspection speed of 2.2 to 27.9 cm2/s.
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Loader/Unloader
Loader/Unloader with Combined Peeling & Loading Functions
Loader/Unloader  from Advanced Engineering
The PAL101 from Advanced Engineering is a Loader/Unloader that can process up to 6 PCB panels per minute. It is based on AE’s proven peeling technology that carries out high-precision peeling for reliable, efficient processing. This machine is powered by the precision of the SERVANT robot with integrated centering that delivers a fully automated, space-saving start to the production line.
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PCB Laminates
Low-Loss Flexible Laminates for High-Frequency Applications
PCB Laminates  from BLUESHIFT
The PhaseBlue 1500 Series from Blueshift Materials are Flexible Laminates designed to deliver relatively high dielectric and thermal performance compared to traditional circuit materials such as PTFE. They are manufactured using a polyimide aerogel core (85% air, 15% polyimide), which is compatible with modern thin-core PCB fabrication processes (e.g., FR-4). This unique material offers high temperature tolerance over PTFE, ensuring long-term durability and reliability in harsh environments.
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