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15 Jan, 2026 Newsletter - PCB Directory

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PCB Insights
Date: 15 Jan, 2026

Sponsored by EMV 2026

Latest PCB News

Yamaha Motor to Launch Hybrid Placer Equipment that Supports 12-Inch Wafers at NEPCON Japan 2026

Yamaha Motor Co., Ltd

Bold Laser Automation Launches LTX1260A 3D Inspection and Measurement System for Precision Manufacturing

BOLD Laser Automation

Global Electronics Association and Altium Launch Two PCB Design Certification Programs

Global Electronics Association

ASC Sunstone Circuits Expands Oregon Facility with Advanced Via Fill Capability

ASC Sunstone Circuits

American Standard Circuits and Sunstone Circuits Unite Under ASC Brand With New Logo

American Standard Circuits

Pinnacle Technology Group Rebrands as PTG Electronics, Unveils New Brand Identity

Pinnacle Technology Group

Sono-Tek Introduces Selective Ultrasonic Flux Spray and Flux Flow Monitoring Systems

SONO-TEK CORPORATION

Additive Circuits Technologies Implements Advanced Additive PCB Manufacturing Processes

Additive Circuits, Inc

Nordson SELECT Synchro Boosts Kamstrup Throughput by 20% While Reclaiming Factory Floor Space

Nordson Corporation

Siemens Acquires ASTER Technologies to Strengthen PCB Test and Verification Capabilities

Siemens

Sponsored by EMV 2026

Creating a compatible future: The EMV 2026 brings Europe’s EMC community together

The EMV 2026 will take place in Cologne from 24–26 March, inviting attendees to Europe’s leading event for electromagnetic compatibility. The trade fair and conference offer an overview of the market, knowledge sharing, and practical insights. Click here to learn more.

New PCB Equipment

LED Emitter-Based Curing Conveyor System with a Curing Area of 12.7 x 12.7 cm

PCB Conveyor from Dymax

The AX-550 V2.0 from Dymax Corporation is a Light Curing Conveyor System designed for fast curing of adhesives, coatings, and inks that react in the UVA and/or visible spectral range. It supports both right-to-left and left-to-right conveyor directions and has a width of 30.48 cm. This system has a belt speed of 0.8 to 32.0 ft/min. It integrates seamlessly with Dymax’s BlueWave AX-550 LED flood lamps, supporting up to four LED emitters with an adjustable curing area size of 12.7 x 12.7 cm.

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2D AOI System with MDMC Technology for PCB Sizes of 50x50 mm to 680x510 mm

Automated Optical Inspection (AOI) Equipment from Omron Corporation

The VT-Z600 from Omron Corporation is an Automated Optical Inspection (AOI) System that performs 2D inspection in a single lane (pre-reflow and post-reflow). It uses next-generation MDMC Color-Highlight technology and consists of a high-speed 12/25 MP camera with a resolution of 12.5 µm and a field of view (FOV) of 50.0 x 37.5 mm. This technology provides multi-directional and multi-color illumination with highly robust and reliable inspection performance.

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3D SPI Equipment for SMD Production Applications

Solder Paste Inspection Equipment from Viscom AG

The iS6059 SPI from Viscom is a Solder Paste inspection (SPI) Equipment that is designed to inspect solder paste application in SMD production. It uses an orthogonal 3D camera with the latest XM-SPI-II 3D sensor technology, which produces realistic color images for quick and clear verification, and 4 angled cameras, which produce four lateral views results in the highest inspection quality. This camera has a resolution of 12 µm and a field of view of 58 x 58 mm.

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New White Papers & Articles

Advanced Surface Finishes for Enhanced PCB Performance - PICA Manufacturing Solutions

Synchronizing PCB, Multi-Board, & Harness Design - Altium Limited

Specifying Impedance Requirements in Rigid Flex PCB’s - All Flex Solutions

More Whitepapers