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PCB Equipment Digest - January 2026

29 Jan, 2026 Newsletter - PCB Directory

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Equipment Digest
Date: 29 Jan, 2026
 
Sponsored by EMV 2026
 
 
Top PCB Equipment
Automated Optical Inspection (AOI) Equipment
Smart 3D AOI System with 4-way Projectors
Automated Optical Inspection (AOI) Equipment  from ViTrox Corporation Berhad
The V510Ai ST from ViTrox Corporation Berhad is an AOI Equipment that uses Phase Shift Profilometry (PSP) Methodology for 3D inspection with 4-way projectors. It has a 12MP CoaXPress camera that has an inspection speed of 64 cm²/sec. This camera uses a 15µm telecentric lens that has a FOV of 60 x 45 mm or a 13µm telecentric lens that provides a FOV of 52 x 39 mm. It has a multicolor, multi-angle, multi-segment LED lighting head with an auto calibration concurrent lighting module.
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Pick and Place Machine
High-Accuracy Pick-and-Place Machine for PCB Sizes of 48x48 mm to 610x380 mm
Pick and Place Machine  from Fuji America Corporation
The NXT-H from Fuji America Corporation is a Pick-and-Place Machine designed for high-accuracy placement of SMT components on PCBs with sizes of 48 x 48 mm to 610 x 380 mm. It consists of a linear motor, heads, feeders, nozzles, and high-resolution cameras. This machine utilizes advanced control technology, thereby enabling it to combine optimum placement pressure, high placement accuracy and high-quality.
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Automated Optical Inspection (AOI) Equipment
2D AOI System with MDMC Technology for PCB Sizes of 50x50 mm to 680x510 mm
Automated Optical Inspection (AOI) Equipment  from Omron Corporation
The VT-Z600 from Omron Corporation is an Automated Optical Inspection (AOI) System that performs 2D inspection in a single lane (pre-reflow and post-reflow). It uses next-generation MDMC Color-Highlight technology and consists of a high-speed 12/25 MP camera with a resolution of 12.5 µm and a field of view (FOV) of 50.0 x 37.5 mm. This technology provides multi-directional and multi-color illumination with highly robust and reliable inspection performance.
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Solder Paste Inspection Equipment
3D SPI Equipment for SMD Production Applications
Solder Paste Inspection Equipment  from Viscom AG
The iS6059 SPI from Viscom is a Solder Paste inspection (SPI) Equipment that is designed to inspect solder paste application in SMD production. It uses an orthogonal 3D camera with the latest XM-SPI-II 3D sensor technology, which produces realistic color images for quick and clear verification, and 4 angled cameras, which produce four lateral views results in the highest inspection quality.
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Sponsored by EMV 2026
EMV 2026
Creating a compatible future: The EMV 2026 brings Europe’s EMC community together
The EMV 2026 will take place in Cologne from 24–26 March, inviting attendees to Europe’s leading event for electromagnetic compatibility. The trade fair and conference offer an overview of the market, knowledge sharing, and practical insights. Click here to learn more.
X-ray Inspection Equipment
X-Ray Inspection Equipment with Microfocus X-Ray and Camera
X-ray Inspection Equipment  from Pluritec
The X-Measure from Pluritec is an X-Ray Inspection Equipment that has a microfocus X-ray and a high-resolution camera. It uses a sophisticated X-Ray system to detect the panel’s inner layers, targets, and compute deformation compensation (linear, non-linear rotation, offset, and scaling), drilling optimized tooling, and reference holes. This machine has a table with a gantry system and individual linear scales for maximum accuracy.
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Flying Probe Tester
Horizontal, Double-Sided Flying Probe Tester for PCB Sizes of 280 x 260 mm
Flying Probe Tester  from HIOKI E.E. Corp
The FA1823 from HIOKI is a Horizontal, Double-Sided Flying Probe Tester that has 4 probe arms (2 top and 2 bottom). It is designed to conduct high-precision probing and 4-wire low-resistance (Kelvin) measurements on ultra-fine pads as small as 19 µm. This probe tester consists of a loader with a conveyor belt and a camera. The tester allows multiple sheets to be automatically and continuously inspected by placing a board with sizes of 280 x 260 mm on the loader, while the built-in camera achieves high probing accuracy by adjusting the camera height to match focus during alignment and minimize correction error.
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PCB Conveyor
LED Emitter-Based Curing Conveyor System with a Curing Area of 12.7 x 12.7 cm
PCB Conveyor  from Dymax
The AX-550 V2.0 from Dymax Corporation is a Light Curing Conveyor System designed for fast curing of adhesives, coatings, and inks that react in the UVA and/or visible spectral range. It supports both right-to-left and left-to-right conveyor directions and has a width of 30.48 cm. This system has a belt speed of 0.8 to 32.0 ft/min. It integrates seamlessly with Dymax’s BlueWave AX-550 LED flood lamps, supporting up to four LED emitters with an adjustable curing area size of 12.7 x 12.7 cm.
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PCB Prototyping Equipment
PCB Prototyping Equipment that uses a Precision Picosecond Laser
PCB Prototyping Equipment  from LPKF Laser & Electronics North America
The LPKF ProtoLaser R4 from LPKF Laser & Electronics North America is a PCB Prototyping Equipment that uses precision picosecond lasers for microprocessing materials. It has a laser output of 8 W and produces a 15 μm laser of a wavelength of 515 nm, a laser pulse frequency of 50-500 kHz & laser pulse width of 1.5 ps. This picosecond-fast laser pulses allow for extremely precise structuring of delicate substrates and cutting of hardened or fired technical substrates without damaging them.
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Sponsored by EMV 2026
 
 
Solder Pot
Solder Pot with Temperature Range of 50 to 530 Degree C
Solder Pot  from HAKKO Corporation
The FX-305 from HAKKO Corporation is a Solder Pot that has a temperature range of 50 to 530 Degree C. It can accommodate 3 sizes of pots measuring 50 x 50 mm, 75 x 75 mm (pre-equipped), and 100 x 100 mm that have a molten solder handling capacity of 0.85 kg, 1.9 kg, and 2.75 kg, respectively. This solder pot has a solder pot cover that prevents splashing while melting the solder and an LCD that displays the temperature in the pot for precise control.
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Dry Cabinet
Dry Cabinet for Ultra-Low Humidity Baking and Long-Term Storage
Dry Cabinet  from Totech
The MSD-1106-02A from Totech is a Dry Cabinet that operates at a temperature of up to 60 Degree C. It can control humidity precisely by adjusting at ±0.1%RH and has effective thermal insulation to lower energy consumption. This dry cabinet has a dehumidifying capacity of 1041 L and has 5 shelves with a loading capacity of 100 kg each. It has an interlocked fan that causes the air to circulate through the dry unit.
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Solder Paste Dispenser
Solder Paste Dispenser for PCB Sizes of 50 x 50 mm to 510 x 460 mm
Solder Paste Dispenser  from Yamaha Motor Co., Ltd
The YRM-D from Yamaha Motor is a Solder Paste Dispenser designed to support high-density and high-precision mounting of SMT components. It can accommodate PCB board sizes of 50 x 50 mm to 510 x 460 mm. This dispenser machine consists of a heater unit, a servo motor, an ASSY adapter, joint nozzles, and control features. The heater unit provides high-precision temperature control to maintain constant dispensing fluid conditions and the dispense head supports independent Z/R-axis servo control during dispensing various types of fluids.
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Solder Paste
Halogen Free Air Reflow Solder Paste for Low Flux Spatter
Solder Paste  from Indium Corporation
The NC-SMQ92H from Indium Corporation is a Halogen Free Air Reflow Solder Paste that is formulated for low flux spatter. It has a low-oxide spherical powder composed of SnPb and SnPbAg in the industry standard Type 3 mesh size with a metal load of 84-92% for standard alloy compositions. This solder paste has a clear, benign hard flux residue with the capability to accommodate high reflow temperatures and meets or surpasses all ANSI/J-STD-004, -005 specifications & Bellcore test criteria.
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