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20th June 2023 Newsletter - PCB Directory

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Monthly Edition
Date: 20th June 2023

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New PCB Equipment

Flame-Retardant Glass Reinforced Hydrocarbon Laminates

PCB Laminates from Rogers Corporation

The Anteo™ from Rogers Corporation are Laminates that are based on glass reinforced hydrocarbon thermoset platform. They are designed with a dielectric constant (Dk) to match that of FR-4 and offer a more cost-effective solution while retaining the tight Dk and thickness tolerances required to cater to the wireless market. These laminates are designed to be fabricated using standard epoxy/glass (FR-4) processes that align with conventional bondplies. The Anteo™ laminates utilize RoHS-compliant flame-retardant technology to achieve a UL 94 V-0 flame retardant rating.

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3D Solder Paste Inspection Equipmentfor PCBs up to 690 x 450 mm

Solder Paste Inspection Equipment from GOEPEL Electronic

The SPI Line•3D from GOEPEL Electronic is a 3D Solder Paste Inspection System that supports PCBs measuring from 60 x 60 mm to 690 x 450 mm, with a thickness range of 0.3 to 5 mm. It has a robust construction and can handle PCB weights of up to 5 kg, making it suitable for various production requirements. This system features a high-resolution camera system with double-sided projection and captures intricate details with its 4-megapixel camera that operates at a speed of 180 frames per second.

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3D Solder Paste Inspection Equipment for PCBs up to 510 x 510 mm

Solder Paste Inspection Equipment from ViTrox Corporation Berhad

The V310i from ViTrox Corporation is a 3D Solder Paste Inspection (SPI) Equipment that works on precision and delivers the right output. It has a field view of 503 x 510 mm and can operate on PCB’s measuring upto 510 x 510 mm. The V310i supports circuit boards with an optimum thickness from 0.5 to 4 mm and weighing up to 3kg. It has abundant top/edge/bottom clearance space which allows the camera or sensor to move freely and capture clear images of the solder paste deposits on the PCB.

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High-Speed Dispenser with Dispensing Area of up to 350 x 520 mm

Dispenser from GKG ASIA PTE LTD

The D-VIS from GKG ASIA is a multi-function Dispenser equipped with fine volume control and positional accuracy. It has a dispensing area from 50 mm x 50 mm to 350 mm x 520 mm and accommodates a wide range of dispensing requirements. This dispenser provides excellent results with a positioning accuracy of +/-30 microns at 4 sigma.

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3600 CPHPick and Place Machine for Min. Components of 0201

Pick and Place Machine from PPM, Inc

The 4000C/68 from PPM is a High-Performance Pick and Place Machine that supports PCBs from 51 x 76 mm to 457 to 607 mm. It has 6 heads that use vision detection to handle various components of varied sizes and ensures precise component placement of components as small as 0201 and as big as 76.2 mm. This machine has a placement rate of 3600 cph and can handle up to 68 feeders. It has a fine pitch of 0.060mm and repeatability of +/- 0.01mm.

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506 LitreDry Cabinet with a Humidity Range of <5% RH

Dry Cabinet from W-TECH

The X2B-400 by W-TECH is a Dry Cabinet that provides a controlled environment for storing moisture-sensitive electronic components like PCBs, lenses, and cameras. It has three shelves which make up a capacity of 506 Litres. It features fully auto dry cabinets that are designed to be stable at <5%RH without adjustment according to the J-STD-033C standard for moisture-sensitive SMT components (MSL 2 up to 6). This dry cabinet maintains the perfect humidity levels using an intuitive digital control panel.

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Wave Soldering Equipment for PCB Width of up to 508 mm

Wave Soldering Equipment from ITW EAE

The VectraElite (VC-3) from ITW EAE is a Wave Soldering Equipment which supports PCB width of up to 508 mm. It includes features, such as ServoJet™ fluxing, forced convection preheat, and UltraFill 4.0, DwellMax 4.0, and DwellFlex 4.0 solder nozzles to provide board assemblers with the capability to handle the most demanding soldering applications.The system's Auto Exit Wing provides automated adjustment of the laminar wave flow to reduce defects, and the DwellFlex 4.0 solder nozzle is designed for Industry 4.0 automation.

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Solder Paste Inspection Equipment for PCB Size up to 510 x 510 mm

Solder Paste Inspection Equipment from CyberOptics Corporation

The SE3000-DD by CyberOptics Corporation is a Solder Paste Inspection Equipment that supports PCB sizes from 510 x 310 mm to 510 x 510 mm. It has a field view of 21 x 21 mm and supports an optimum thickness of the PCB from 0.3 to 5 mm which can weigh up to 3kg. The equipment has an optimal top clearance space of 50 mm, edge clearance space of 3 mm, and bottom clearance space of 30 mm which allows the camera or sensor to move freely and capture clear images of the solder paste deposits on the PCB.

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Thermally Reliable Hydrocarbon and Ceramic Based Laminate

PCB Laminates from Ventec International Group

The VTM1000i from Ventec is a Hydrocarbon and Ceramic-Based Laminate. It has a dielectric constant (Dk) of 9.8 (at 10 GHz) and a loss tangent (Df) of 0.0023 with excellent thermal reliability. This laminate has a Decomposition Temperature (Td) of 426°C and a thermal conductivity of 1.00 W/mK. It is available in core thickness from 0.015 to 0.150 inches and is suitable for use in satellite communication systems, power amplifiers, global positioning system antennas, filters and couplers and RF and Microwave circuitry applications.

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8-Head Flying Probe Tester for PCBs Dimension up to 610 x 508 mm

Flying Probe Tester from Gardien S.C.A.

The Gardien AC8 by Gardien S.C.A. is a Flying Probe Tester with 8 heads-to-mount testing probes that ensure efficient testing of PCBs. It can support PCB size of up to 610 x 508 mm and ensures constant throughput speed irrespective of test point count (max. 60 sec per panel including handling). It uses capacitive scan with industry standard test method as known from conventional flying probe testers. This tester is available in an enclosure that measures 2100 x 1050 x 1250 mm.

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Selective Soldering Machine for PCBs up to 500 x 500 mm

Selective Soldering Machine from DDM Novastar Inc

The ESS-500 from Novastar is a Selective Soldering Machine that supports PCBs from 25 x 25 mm to 500 x 500mm. It has a solder pot capacity of 15 kg and provides a soldering temperature of 400°C. All of this combined with its IR heating power of 1.2 kW makes this machine an ideal choice for a variety of soldering applications. The equipment has a conveyor speed of 6 m/min, a position accuracy of ± 0.1 mm, and a heating time of approximately 45 minutes.The ESS-500 is designed for short-run, mixed technology applications and provides the throughput, accuracy, and reliability to improve productivity.

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