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Latest News & White Papers this Week

27 Nov, 24 Newsletter - PCB Directory

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Weekly Edition
Date: 27 Nov, 24
 
Sponsored by Asia Photonics Expo 2024
 
 
Latest News this Week
News
NetVia Group Integrates KLA's Advanced CAM Software to Enhance PCB Production Capabilities

NetVia Group, LLC
News
Kurtz Ersa Introduces New Rework System with Automated Residual Solder Removal at Electronica 2024

Kurtz Ersa
News
Scienscope Introduces New Offline X-ray Inspection System for Inspection of Long PCBs

Scienscope
News
PCB Design Software Market Expected to Grow to $6 Billion by 2032, with a CAGR of 14%

HTF MI
News
Emil Otto Introduces New Variants of its Alcohol-Based Fluxes for Enhanced Soldering

EMIL OTTO
News
IPC Releases Industry’s First Standard for In-Mold Electronics with New IPC-8401 Guidelines

IPC
Featured White Papers & Articles
Addressing High Precision Automated Optical Inspection Challenges With Unique 3d Technology Solution - Nordson Corporation
Formulation of a New Liquid Flux for High Temperature Soldering - FCT Solder
Hand Soldering with Lead-Free Alloys - Metcal
What is Non-Destructive Testing (NDT) in PCBs? - PCB Directory
More Whitepapers
Sponsored by Asia Photonics Expo
Asia Photonics Expo
Asia Photonics Expo (APE): Gateway to Photonics Market in Asia
APE, Asia's premier photonics event, returns to Singapore's Marina Bay Sands, February 26-28, 2025. Discover cutting-edge optics, lasers, and semiconductor applications in a 15,000 sqm exhibition featuring 400+ exhibitors. Join 5,000+ industry professionals for insights and innovation. Click here to learn more.
Latest Products this Week
Rework Station
Rework Station for PCB Sizes of up to 380 x 300 mm
Rework Station  from Kurtz Ersa

The HR 600P from Kurtz Ersa is an Automatic Rework System that can accommodate PCB sizes of up to 380 x 300 mm. It has a 5 MP GigE color camera as the placement camera on top and a servomotor-driven component camera on the bottom. This rework system has a 10.7 MP CMOS GigE color camera for the reflow process with a focal length of 50 mm and 2 LEDs for illumination.
Download Brochure Product Details
X-ray Inspection System
X-ray Inspection System with a five-axis sample table for multi-directional imaging
X-ray Inspection System  from Toshiba IT & Control Systems Corporation

The TXP-5150FD from Toshiba IT & Control Systems Corporation is an X-ray Fluoroscopic Inspection System with a five-axis sample table for multi-directional imaging. It is suitable for inspecting small- to medium-sized aluminum die castings, mechanical components, electronic parts, and resin moldings, etc. This system has a table measuring 500 mm in diameter that can handle medium to large-size samples.
Download Brochure Product Details
PCB Design Software
Design Software with interactive 3D Canvas
PCB Design Software  from Cadence Design Systems, Inc

The OrCAD X Platform from Cadence incorporates Cadence Allegro X technology into a PCB design solution suited for quick-turn projects. It provides features like real-time insights, simplified manufacturing, and live DRCs. With user-friendly features including cloud-connected workspaces and ECAD/MCAD collaboration, engineers can seamlessly navigate schematic capture, circuit simulation, and PCB layout.
Download Brochure Product Details
PCB Curing Oven
TC88 curing ovens for PCB size up to 660mm X 760mm
PCB Curing Oven  from Taiyo Circuit Automation, Inc.

The TC88 from Taiyo Circuit Automation is a Conveyorized Oven that can accommodate PCBs measuring up to 660 x 760 mm. It has 1 heat zone with a heat chamber length of 3.3 m and can reach a maximum temperature of 190°C. This oven employs patented controls that intermix the airflow from end to end inside the fan plenum and modulate flow via computer-controlled dampers.
Download Brochure Product Details
Solder Paste
Innolot MXE Alloy Solder Paste for Electronics Manufacturing
Solder Paste  from MacDermid Alpha Electronics Solutions

The CVP-390V INNOLOT MXE from MacDermid Alpha Electronic Solutions is a Lead-free Solder Paste that is composed of an Innolot MXE alloy. It uses a no-clean flux, which results in a clean flux residue during the soldering process. This paste is engineered to deliver advanced thermomechanical performance for the rapidly growing reliability standards.
Download Brochure Product Details
Sponsored by Asia Photonics Expo 2024
 
 
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