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20 Mar, 2025 Newsletter - PCB Directory

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Weekly Edition
Date: 20 Mar, 2025
 
Featured Event
 
 
Latest News this Week
News
YINCAE Launches New Underfill Material for Production of Large Format Chips

YINCAE
News
electronica China 2025 to be Held from 15 to 17th April in Shanghai

electronica China
News
Ventec Introduces New Prepreg Material for High Layer Count HDI PCB Designs

Ventec International Group
News
DuPont Wins 2025 NPI Award for its Double-Sided Metal-Clad Laminates

DuPont
News
Cybord Launches New AI-Powered RTI Solution to Prevent Assembly of Defective Electronic Components on PCBs

Cybord
News
TRI Wins Two CIRCUITS ASSEMBLY NPI Awards for its AI-Powered 3D AXI and High-Pin-Count ICT

Test Research, Inc
Featured Event
NEPCON
NEPCON China: Premier B2B Event for Electronics & Semiconductor Industries
NEPCON China is a leading B2B event that converges global circuit board assembly and advanced solutions suppliers that serve the Electronics, Semiconductor, Automotive and New Energy industries. The concurrent highly interactive events include conferences, competitions, award programs and business matchmaking, providing a great business networking and learning platform for professionals from different regions at different levels in different application industries. Click here to register now.
Latest White Papers & Articles
Optimizing Design for Flexible Circuits: Best Practices & Advanced Design Strategies - PICA Manufacturing Solutions
Advanced Surface Finishes for Enhanced PCB Performance - PICA Manufacturing Solutions
Electrical Engineering Interviewing Cheatsheet - Summit Interconnect
More Whitepapers
Upcoming Event
Event Image
Electronic Components and Technology Conference (ECTC) 2025
Date: May 27-30, 2025
Location: Dallas, Texas, United States
More Events
Latest Products this Week
Pick and Place Machine
Fully Automated Pick and Place Machine for PCB Sizes of up to 760 x 687 mm
Pick and Place Machine  from Panasonic Corporation

The NPM-GW from Panasonic Corporation is a Pick and Place Machine that can accommodate PCB sizes of up to 760 x 687 mm. It supports multiple placement heads, including FC16, FC08, and FC03, and has a placement speed of up to 52000 cph (FC16), 26500 cph (FC08) or 10000 cph (FC03). These placement heads have a placement accuracy of ±25 µm.
Download Brochure Product Details
Flying Probe Tester
Automated Flying Probe Tester for PCB Sizes of up to 610 x 510 mm
Flying Probe Tester  from MicroCraft K.K.

The E4S6151G-AL from MicroCraft K.K. is a Fully Automated Flying Probe Test System that has 2 front and 2 rear probes. It can accommodate PCB sizes of up to 610 x 510 mm and can handle board thicknesses ranging from 0.5 mm to 5.0 mm. This system features an automated loading and unloading system and has a repeatable accuracy of ±2 µm.
Download Brochure Product Details
Conformal Coating Materials
Solvent-Free Thick Film Conformal Coating Material for Electrical Insulation after UV Curing
Conformal Coating Materials  from Peters Group

The UV Twin-Cure® DSL 1600 E-FLZ/150 from Peters Group is a Thick Film Conformal Coating Material based on a polyurethane and polyacrylate copolymer. It has a dielectric strength of more than 90 kV/mm and a comparative tracking index (CTI) of more than 600. This conformal coating material is UL-approved according to UL 94 for the best flame class V-0.
Download Brochure Product Details
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