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15 May, 2025 Newsletter - PCB Directory

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Weekly Edition
Date: 15 May, 2025
 
Sponsored by DigiKey
 
 
Latest News this Week
News
Altium Introduces Virtual Collaboration Tool for Electrical and Mechanical Engineers to Optimize Workflow

Altium Limited
News
Zuken Launches 2025 Version of its AI-Based PCB Design Platform for High-Speed & High-Density Electronics

Zuken Inc
News
Kaynes Technology Acquires August Electronics to Expand Electronics System Design & Manufacturing

August Electronics Inc.
News
Indium Corporation Expert to Present on Dual Alloy Solder Paste Systems at SMTA Conference

Indium Corporation
News
TTM Technologies Announces Retirement of Founder and Industry Pioneer Kent Alder

TTM Technologies
News
Test Research, Inc. to Showcase PCB Test and Insepection Solutions at SMTA Oregon Expo 2025

Test Research, Inc
Sponsored by DigiKey
RNBD350PE-I100
RNBD350PE-I100 Plug-and-Play Bluetooth® Low Energy Module
Fully RF-Certified solution for Bluetooth 5.2 Low Energy connectivity. On-board PCB antenna, creates an easy-to-use turnkey solution. Click here to learn more.
Latest White Papers & Articles
Assembling High Current Heavy Copper PCBs - Summit Interconnect
Hand Soldering with Lead-Free Alloys - Metcal
What are RF PCBs? - PCB Directory
More Whitepapers
Upcoming Event
Event Image
China International Optoelectronic Exposition (CIOE) 2025
Date: Sep 10 - Sep 12, 2025
Location: Shenzhen, China
More Events
Latest Products this Week
Solder Flux
No Clean, Alcohol Based Solder Flux for Selective, Wave, Dip and Cable Assembly Soldering
Solder Flux  from Emil Otto

The EO-B-008B from Emil Otto is an Alcohol-Based No-Clean Solder Flux based on a di-carboxylic acid-resin complex and synthetic resin. It has a solid content of 2.9 -3.2% by weight and is halogenide-free, making it compliant with WEEE/RoHS standards. This flux has good wetting & capillarity properties, a wide process window with high thermal stability, and leaves no residue after the soldering process.
Download Brochure Product Details
Solder Paste Inspection Equipment
Solder Paste Inspection Equipment for PCB Sizes of up to 450 x 450 mm
Solder Paste Inspection Equipment  from Test Research, Inc

The TR7007Q SII-S from Test Research, Inc. (TRI) is a Solder Paste Inspection Equipment that uses Stop-and-Go Imaging technology. It has a 25 MP top camera with an imaging resolution of 3.5 µm or 6 µm and an imaging speed of up to 2.1 FOV/ sec. This equipment can accommodate PCB sizes up to 450 x 450 mm and a PCB thickness of 0.6 to 5 mm.
Download Brochure Product Details
Pick and Place Machine
Pick and Place Machine with a Placement Speed of 22,000 CPH
Pick and Place Machine  from Hanwha Precision Machinery

The HM520W HP from Hanwha Precision Machinery is a Pick and Place Machine that has 8 spindles and 2 gantries. It has a placement speed of 22,000 CPH and a placement accuracy of ±40 µm for chip components and ±20 µm for ICs. This machine accommodates component sizes ranging from 0603 to 150 x 74 mm, making it ideal for a wide range of components.
Download Brochure Product Details
Featured Interview
Webinar Image
A talk with Tom Krol, Director of Strategic Accounts at ThermOmegaTech’s Electronics Division>
Tom Krol is the Director of Strategic Accounts at ThermOmegaTech’s Electronics Division in Warminster, Pennsylvania, United States. Tom has been a part of ThermOmegaTech for years and has over 24 years of industry experience. He completed his BSEE degree in Electrical Engineering from the College of New Jersey in 2002 and has been a member of IEEE since 1998.
Sponsored by DigiKey
 
 
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