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Latest News & White Papers this Week

26 Jun, 2025 Newsletter - PCB Directory

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Weekly Edition
Date: 26 Jun, 2025
 
Sponsored by Summit Interconnect
 
 
Latest News this Week
News
Arch Systems Partners with Jabil to Advance Smart Manufacturing with Data-Driven Insights

Jabil Inc
News
Emil Otto Introduces Enhanced Flux Remover for Manual Electronics Cleaning

Emil Otto
News
IPC Rebrands as Global Electronics Association, Unveils New Vision Dedicated to Enhancing Supply Chain

Global Electronics Association
News
SCS Relocates Swiss Operations to New Custom Facility and Rebrands as Specialty Coating Systems SA

Specialty Coating Systems Inc
News
Siemens Unveils AI-Powered EDA System to Transform Semiconductor and PCB Design

Siemens
News
ASC Sunstone Circuits and Screaming Circuits Launch Integrated Online PCB Assembly Parts Ordering Feature

Screaming Circuits
Sponsored by Summit Interconnect
Summit Interconnect
Summit Interconnect – Your One-Stop PCB solution
Summit Interconnect is the largest privately held PCB manufacturer in North America—your one-stop partner for fabrication and assembly. From quick-turn prototypes to complex builds, we power today’s most advanced, high-performance electronics. Click here to learn more.
Latest White Papers & Articles
Flexible Substrates for Smart Sensor Applications - DYCONEX AG
PCB Assembly Overview - Summit Interconnect
What is a Modular PCB? - PCB Directory
More Whitepapers
Featured Products this Week
Reflow Soldering Equipment
Vapor Phase Reflow Soldering System for PCB sizes of up to 750 x 620 mm
Reflow Soldering Equipment  from ASSCON Systemtechnik-Elektronik GmbH

The VP2100 from ASSCON Systemtechnik-Elektronik GmbH is a Vapor Phase Vacuum Reflow Soldering Equipment that is equipped with Multi-Vacuum technology. It has single-lane transport and accommodates PCB sizes of up to 750 x 620 mm and components of up to 60 mm in height. This reflow soldering equipment has a smart energy management system that reduces consumption by up to 70%.
Download Brochure Product Details
Solder Flux
No Clean, Alcohol Based Solder Flux for Selective, Wave, Manual, and Strand Tinning Soldering
Solder Flux  from Emil Otto

The EO-B-013B from Emil Otto is an Alcohol-Based No-Clean Solder Flux that is based on a di-carboxylic acid-resin complex and synthetic resin. It has a solid content of 2.9-3.2% by weight and is free from corrosion action & halogenide-free, making it compliant with WEEE/RoHS standards. It has a shelf life of 24 months and is available in 5 or 20-L canisters.
Download Brochure Product Details
PCB Laminates
Glass-Reinforced, PTFE-based Low-Loss Antenna Laminate
PCB Laminates  from Rogers Corporation

The AD300D from Rogers Corporation is a Glass-reinforced, PTFE-based Antenna Laminate for RF and wireless infrastructure. It has a dielectric constant (Dk) of 2.94 and a dissipation factor (Df) of 0.0021 at 10 GHz. This material has a thermal coefficient of -73 ppm/°C and a decomposition temperature greater than 500°C.
Download Brochure Product Details
Featured Interview
Webinar Image
A talk with Davor Salahovic, Director of Business Development at Bittele Electronics
Davor Salahovic is the Director of Business Development at Bittele Electronics, a leading provider of prototype and small-to-mid-volume PCB assembly services and turn-key solutions. With over 20 years of experience in the microelectronics industry, Davor has been pivotal in accelerating the company’s growth and enhancing its market presence. In his present role, Davor is setting strategic direction for growing Bittele’s global client footprint and expanding long-term MNC partnerships.
Sponsored by Summit Interconnect
 
 
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