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Latest News & White Papers this Week

31 Jul, 2025 Newsletter - PCB Directory

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New Products Directory News. Whitepapers Articles Calculators Events Webinars
 
Weekly Edition
Date: 31 Jul, 2025
 
Sponsored by Summit Interconnect
 
 
Latest News this Week
News
Diode Computers Develops AI-Powered Tools to Revolutionize PCB Design and Manufacturing

Diode Computers
News
Meiko Group Inaugurate $200 Million PCB Manufacturing Plant in Phu Tho Province of Vietnam

Meiko Group
News
OKI Unveils Space-Grade Rigid-Flex PCBs with Embedded Copper Coins for Superior Heat Dissipation

Oki Printed Circuits Co, Ltd
News
Videoton Strengthens Global Reach with Acquisition of Stakes in Limtronik and New Production Sites

Videoton Group
News
Würth Elektronik Opens New Branch in South Africa to Serve Emerging African Markets

Würth Elektronik GmbH
News
North American PCB Shipments Drop 8.6 Percent in June Despite Positive Bookings Trend

Global Electronics Association
News
Wipro Infrastructure Engineering Launches Rs 500 Cr PCB Materials Division to Boost Domestic Production

Wipro Infrastructure Engineering
News
Suzhou Dongshan Precision to Invest Up to 1 Billion Dollars in High-End PCB Project

Suzhou Dongshan Precision Manufacturing
Sponsored by Summit Interconnect
Summit Interconnect
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Featured Products this Week
Solder Paste
Rosin Mildly Activated, Sn-Pb Solder Paste for Mixed Metallurgy Applications
Solder Paste  from FCT Solder
The RMA250 from FCT Solder is a Rosin Mildly Activated (RMA) Sn-Pb Solder Paste that can be coupled with solder alloys like Sn63/Pb37, Sn62/Pb36/Ag2, and anti-tombstoning mixtures. It delivers high activity and excellent wetting with very low solder balling, graping, and minimal voiding potential. It has a shelf life of 9 months (at 0 to 10 °C).
Download Brochure Product Details
PCB Laminates
Polyimide Prepreg for High-Reliability Rigid-Flex Applications
PCB Laminates  from Ventec International Group
The VT-901N from Ventec International Group is a Polyimide Low Flow Prepreg that is designed for rigid-flex PCB applications. It has a glass transition temperature (Tg) of 200°C and a thermal decomposition temperature (Td) of 390°C. This prepreg has a coefficient of thermal expansion of 12 to 15 ppm/°C on the XY axis, 50 ppm/°C on the Z axis.
Download Brochure Product Details
In-Circuit Tester
Dual-Panel In-Circuit Tester for High-Speed Parallel Testing
In-Circuit Tester  from CheckSum, LLC
The ILS-X2 from CheckSum is an In-Circuit Tester (ICT) that supports the complete suite of CheckSum’s Parallel Test including ICT, ISP and PFT (Parallel Functional Testing). It can support up to two panels simultaneously in a single fixture and has top and bottom probing. This tester has automatic width adjustment, and a PCB probe area of up to 24 x 13.2 inches.
Download Brochure Product Details
Latest White Papers & Articles
From Concept to Production: A Modern Approach to Wire Harness Engineering - Altium Limited
Improving Solder Paste Printing With Squircle Aperture Designs - AIM Solder
PCB Assembly Overview - Summit Interconnect
What is PCB Reverse Engineering? - PCB Directory
More Whitepapers
Upcoming Event
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electronica India 2025
Date: Sep 17-19, 2025
Location: Bangalore International Exhibition Centre Bangalore, India
More Events
Featured Interview
Webinar Image
A talk with Abhay Doshi, President and Managing Director of Fine-Line Circuits Ltd
Abhay B. Doshi has been a board member of Fine-Line Circuits Ltd since 1990. As a founding director, he has been active in the company's management since its start. He holds a Bachelor's degree in Electronics and Communication Engineering from Mysore, India, and an MBA with a focus on Finance from the University of California, Berkeley, USA. Before founding Fine-Line Circuits Limited, he gained experience in high technology while working at Maxtor Corporation in San Jose, California, within Silicon Valley.
Sponsored by Summit Interconnect
 
 
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