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18 Sept, 2025 Newsletter - PCB Directory

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Weekly Edition
Date: 18 Sept, 2025
 
Sponsored by Summit Interconnect
 
 
Latest News this Week
News
Syrma Group to Setup a PCB Manufacturing Facility in Andhra Pradesh with an Investment of $121.8 Million

Syrma SGS Technology Pvt. Ltd
News
Panasonic to Double the Capacity of MEGTRON Multi-Layer PCB Materials Over the Next Five Years

Panasonic Corporation
News
Ascent Circuits Invests Rs. 1100 Crore to Setup a PCB Manufacturing Facility in Tamil Nadu

Ascent Circuits Pvt. Ltd
News
Yamaha Adds New Features to its Equipment Software to Boost Efficiency and Productivity in Factories

Yamaha Motor Co., Ltd
News
Syrma SGS & Elemaster Form Strategic Joint Venture for High-Reliability Electronics Manufacturing in India

Syrma SGS Technology Pvt. Ltd
News
Variosystems Strengthens North American Presence with a Relaunch in Southlake, Texas

Variosystems AG
Sponsored by Summit Interconnect
Webinar
Webinar: IPC Standards for Quick-Turn PCB Assembly – 9.25 | 11 AM PT
Discover key insights into IPC standards for quick-turn, prototype PCB assembly. Learn best practices that improve speed, quality, and reliability in your projects. Register Now.
Latest White Papers & Articles
Electrical Engineering Interviewing Cheatsheet - Summit Interconnect
Inductive Soldering for High Thermal Demand Applications - Metcal
High-Speed PCB Design Guide - Sierra Circuits
More Whitepapers
Featured Products this Week
Reflow Soldering Equipment
Vapor Phase Reflow Soldering System for PCB sizes up to 1000 x 800 mm
Reflow Soldering Equipment  from ASSCON Systemtechnik-Elektronik GmbH
The VP1000-1080 from ASSCON Systemtechnik-Elektronik GmbH is a Vapor Phase Reflow Soldering System engineered for precise, oxidation-free soldering of large-format PCBs. Designed for efficient single-lane transport, it can handle PCB sizes up to 1000 x 800 mm, components up to 60 mm in height. It supports 24/7 series production and features an internal memory for up to 500 soldering programs.
Download Brochure Product Details
Solder Wire
Lead-Free Sn Ag Cu Alloy -based Solder Wire for Robot Soldering Applications
Solder Wire  from STANNOL GMBH & CO. KG
The 2630 Ecoloy TSC from STANNOL GMBH & CO. KG is a Lead-Free Solder Wire that is based on Sn Ag Cu Alloy. It is specifically developed for assembly operations of electronics manufacturing and can replace eutectic or almost eutectic tin/lead or tin/lead/silver alloys. This solder wire has an exceptionally strong activation that delivers exceptional activity and solder spreading.
Download Brochure Product Details
Sponsored by Summit Interconnect
 
 
Solder Wire
No-Clean Flux-Cored Solder Wire for Selective and hand Soldering
Solder Wire  from Emil Otto
The Solder Wire Sn96.5Ag3Cu0.5 from Emil Otto is a No-Clean Flux-Cored Solder Wire that is designed for selective soldering processes and hand soldering. This innovative tubular solder is filled with EO-FC-006 flux (WEEE/RoHS compliant)—a halogenide-free, high-performance compound based on high-purity synthetic resin and a unique synthetic activation complex.
Download Brochure Product Details
Upcoming Event
Event Image
AEMS 2025
Date: Sep 24-25, 2025
Location: Anaheim Convention Center, California, United States
More Events
Featured Interview
Webinar Image
A talk with Allen Nejah, Founder and CEO at SunMan Engineering, Inc
Allen Nejah is the Founder and CEO of SunMan Engineering, a Silicon Valley-based engineering firm established in 1990. Specializing in product development, engineering, and system-level prototyping, the company has successfully completed over 1,750 projects under Allen's leadership. With more than 30 years of experience in the high-tech industry, Allen is recognized for his strategic vision, hands-on leadership, and unwavering commitment to excellence and customer satisfaction.
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