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Latest News & White Papers this Week

09 Oct, 2025 Newsletter - PCB Directory

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New Products Directory News. Whitepapers Articles Calculators Events Webinars
 
Weekly Edition
Date: 09 Oct, 2025
 
Sponsored by CIOE 2025
 
 
Latest News this Week
News
Omega EMS Announces Expansion into Vietnam to Support Continued Growth and Innovation

Omega EMS
News
NOTE Signs Agreement to Acquire Kasdon Group and Strengthen its Position in the UK EMS Market

Kasdon Electronics Limited
News
Advanced PCB provides DFM Services to Optimize PCB Designs and Layouts with the FreeDFM™ Tool

AdvancedPCB
News
Excello Circuits Specializes in Manufacturing PCBs for the Challenging Conditions of the Oil and Gas Industry

Excello Circuits Inc
News
AT&S to Expand its PCB Technology Portfolio to Support Defense and Security Applications

AT&S
News
Meiko and Allied Circuits to Establish a High-Layer PCB Manufacturing Plant in Vietnam

Meiko Electronics
Sponsored by CIOE 2025
CIOE Event 2025
CIOE 2025 Registration Now Open – Secure Your Spot at the World's Leading Photonics Event!
CIOE 2025 will be held from Sep. 10 - 12, 2025 at the Shenzhen World Exhibition and Convention Center. As a leading event covering the whole optoelectronics industry chain, it gathers over 3,800 top exhibitors from 30+ countries and regions. Click here for more information.
Featured Products this Week
Reflow Soldering Equipment
Vapor Phase Reflow Soldering System for PCB sizes of up to 1500 x 800 mm
Reflow Soldering Equipment  from ASSCON Systemtechnik-Elektronik GmbH

The VP1000-1580 from ASSCON Systemtechnik-Elektronik GmbH is a Vapor Phase Reflow Soldering System engineered for precise, oxidation-free soldering of large-format PCBs. Designed for efficient single-lane transport, it can handle PCB sizes up to 1500 x 800 mm, components up to 60 mm in height.
Download Brochure Product Details
Solder Paste
No-Clean Solder Paste with SAC 305 Metal Alloy Component
Solder Paste  from Emil Otto

The EO-FLP-001 from Emil Otto is a No-Clean Solder Paste that has over 80% composition of the SAC 305 metal alloy component. It has Lead-free and Halide-free activators complying with WEE/RoHS standards. This type ROL0 solder paste has low viscosity, high level of activity and good wetting & spread capabilities.
Download Brochure Product Details
Pick and Place Machine
Pick-and-Place Machine with Placement Speed of 84,000 CPH
Pick and Place Machine  from NECTEC

The NT-T5 from NECTEC is a Pick-and-Place Machine that has dual-arm combination placement heads in 10+10 head (high-speed mounting) or 6+6 head (multifunctional mounting) configurations. It delivers a placement speed of 84,000 CPH and has a placement accuracy of up to ±0.035 mm. It is equipped with a flying 500 W area array MARK camera with a 20 × 20 mm field of view and an optional fixed camera.
Download Brochure Product Details
New White Papers & Articles
Advanced Surface Finishes for Enhanced PCB Performance - PICA Manufacturing Solutions
Impact of TIM Dielectric Constant on EMI Radiation - Laird
What is a Glass PCB Substrate? - PCB Directory
More Whitepapers
Sponsored by CIOE 2025
 
 
Upcoming Event
Event Image
8th NEPCON Nagoya 2025
Date: Oct 29-31, 2025
Location: Port Messe Nagoya, Japan
More Events
Featured Interview
Webinar Image
A talk with Thomas Nether, Senior Vice President at LaserMicronics
Thomas Nether has been serving as Senior Vice President for LaserMicronics, Service Solutions of LPKF Laser & Electronics AG. He has been with LPKF systems for 25 years. He began his journey as a Product Manager, driving the technical development of LPKF tools.
About PCB Directory
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