Epec Provides Laminate Materials for High-Frequency RF/Microwave PCBs

https://cdn.pcbdirectory.com/news/Untitled_design_3__639098552811441603.webp712370

Epec, a U.S.-based electronics manufacturer providing engineered PCB, cable, and custom electronic solutions for industrial and high-reliability applications, provides various RF/microwave PCB laminate materials used in high-frequency circuit design, including key material characteristics, supplier options, and application considerations. When designing PCB circuits at microwave frequencies, the characteristics that define circuit laminate performance include dielectric constant (Dk), dissipation factor (Df), coefficient of thermal expansion (CTE), thermal coefficient of dielectric constant (TCDk), and thermal conductivity. Polytetrafluoroethylene (PTFE) is a commonly used high-frequency material due to its dielectric properties at microwave frequencies. These laminate materials behave differently during processing, making it important to understand how each laminate responds to manufacturing steps.

Epec states that it maintains a stock of high-frequency laminates at its PCB manufacturing facility in Dallas, Texas, and has produced PCBs using these materials for many years. Applications listed include RF antennas, Wi-Fi (carrier-grade and licensed access), IP infrastructure, power amplifiers, diplexers/multiplexers, and test and measurement systems.

The company adds that manufacturing RF PCBs requires experience in engineering and CAM, along with equipment to manage factors such as registration, lamination layer shift, and etching behavior. It also notes the need for tools such as X-ray to maintain production yield.

Isola high performance PCB laminates

Since 1912, Isola has developed copper-clad laminate products used in multilayer PCBs. The material selection involves balancing cost and performance, with considerations including dielectric thickness, dielectric constant, dissipation factor, and tolerance control. RF high-frequency designs require precise control of dielectric constant, line widths, and dielectric thickness.

Epec lists common Isola laminates:

• ASTRA MT77 - Dk 3, Df 0.0017, CTE (X/Y/Z): 12/12/70 ppm/°C, Thermal conductivity: 0.45 W/mK
• I-TERA MT40 - Dk 3.38, Df 0.0028, CTE: 12/12/55, Thermal conductivity: 0.61 W/mK
• IS680 AG-348 - Dk 3.48, Df 0.0029, CTE: 12/12/45, Thermal conductivity: 0.38 W/mK
• I-SPEED - Dk 3.63, Df 0.0071, CTE: 16/18/60, Thermal conductivity: 0.4 W/mK

Rogers materials for RF/microwave designs

Rogers materials are described as widely used for RF/microwave PCB designs, including RT/duroid® PTFE laminates. These materials require specific manufacturing processes due to their behavior during PCB fabrication.

Epec lists common Rogers laminates:

• RO3203 - Dk 3.02, Df 0.0016, CTE: 13/13/58, Thermal conductivity: 0.48 W/mK
• RO3206 - Dk 6.15, Df 0.0027, CTE: 13/13/34, Thermal conductivity: 0.67 W/mK
• RO3210 - Dk 10.2, Df 0.0027, CTE: 13/13/34, Thermal conductivity: 0.81 W/mK
• RO4003C - Dk 3.38, Df 0.0027, CTE: 11/14/46, Thermal conductivity: 0.71 W/mK
• RO4350B - Dk 3.48, Df 0.0037, CTE: 10/12/32, Thermal conductivity: 0.69 W/mK
• RO4450B - Dk 3.3, Df 0.004, CTE: 19/17/50, Thermal conductivity: 0.6 W/mK
• RO4450F - Dk 3.52, Df 0.004, CTE: 19/17/50, Thermal conductivity: 0.65 W/mK

Arlon electronic PCB materials

Arlon Electronic Materials focuses on thermoset resin systems including polyimide, high Tg epoxy, and low-loss laminates. These materials are used in high-reliability and high-speed RF/microwave circuits, including applications exposed to high temperatures such as aircraft instrumentation, down-hole drilling, and RF antennas.

Epec lists Arlon laminates:

• AD250C - Dk 2.5, Df 0.0014, CTE: 16/16/50, Thermal conductivity: 0.3 W/mK
• AD255C - Dk 2.55, Df 0.0014, CTE: 16/16/50, Thermal conductivity: 0.3 W/mK
• AD260C - Dk 2.6, Df 0.0017, CTE: 16/16/80, Thermal conductivity: 0.32 W/mK
• AD300C - Dk 2.97, Df 0.002, CTE: 9/15/54, Thermal conductivity: 0.5 W/mK
• AD320A - Dk 3.2, Df 0.0032, CTE: 14/14/128, Thermal conductivity: 0.45 W/mK
• AD350A - Dk 3.5, Df 0.003, CTE: 5/9/35, Thermal conductivity: 0.45 W/mK

Taconic dielectric materials

Taconic provides PTFE-based laminates with low dielectric constant, low Z-axis CTE, and thermal stability. The materials are designed for RF/microwave PCB manufacturing and aim to provide consistent dielectric properties.

Epec lists Taconic laminates:

• TLY-5 - Dk 2.17, Df 0.0009, CTE: 20/20/280, Thermal conductivity: 0.22 W/mK
• TLC-30 - Dk 3, Df 0.0028, CTE: 9/12/70, Thermal conductivity: 0.24 W/mK
• TLC-32 - Dk 3.2, Df 0.003, CTE: 9/12/70, Thermal conductivity: 0.24 W/mK
• TLF-34 - Dk 3.4, Df 0.002, CTE: 21/23/85, Thermal conductivity: 0.24 W/mK
• RF-35 - Dk 3.5, Df 0.0018, CTE: 19/24/64, Thermal conductivity: 0.32 W/mK
• TLF-35 - Dk 3.5, Df 0.002, CTE: 21/23/85, Thermal conductivity: 0.24 W/mK
• RF-60A - Dk 6.15, Df 0.0038, CTE: 9/8/69, Thermal conductivity: 0.4 W/mK
• TLE-95 - Dk 2.95, Df 0.0026, CTE: 9/12/70, Thermal conductivity: 0.28 W/mK

Panasonic MEGTRON 6

Panasonic MEGTRON 6 is described as a circuit board laminate material used for high-speed applications such as network equipment, mainframes, IC testers, and high-frequency measuring instruments. The material is characterized by low dielectric constant, low dissipation factor, low transmission loss, and heat resistance. Epec also references supporting documentation for MEGTRON 6, including laminate and prepreg datasheets, process guidelines, and IPC-4101E slash sheet matrix.

Click here to learn more about the Epec.