MirXT-160

The MirXT-160 from ElectronicsTalk is a 3D CT X-ray Inspection Equipment that is designed for advanced wafer technology, SMT, packaging inspection, semiconductor, and laboratory applications. It has a submicron X-ray tube with a resolution of 0.35 microns that produces a tube voltage of 160 kV and a power of up to 20 W. This optical system has a transmission tube head with a 170° radiation angle and a collimation function, and a 1536 x 1536 px detector with a geometric magnification of up to 2100x and a total magnification of up to 23000x. It has a maximum detection range of 410 x 410 mm and can accommodate PCBs of sizes up to 510 x 510 mm. This equipment has a specially designed OVHM module that enables the detector to rotate 360 degrees horizontally and tilt 70 degrees. It has an automatic real-time navigation chart and X-ray image navigation chart function.

The MirXT-160 X-ray inspection system can detect solder/tin voids and bonding wire issues commonly found in the SMT and semiconductor manufacturing processes within the electronics industry. It can also effectively identify packaging defects such as offsets, wire cross-short circuits, flip-chip solder ball issues, wire breakage, and detachment. This equipment supports product process programming with an automatic detection function, 5-axis interpolation function, visual CNC detection, and unlimited point editing. Its included image processing software can perform comprehensive X-ray image analysis, including image contrast enhancement and filtering, measurement, and CNC programming. This equipment has an automatic BGA solder joint detection function in BGA mode and a VC mode that includes automatic calculation of void area ratio, including a multi-chip mounting void detection function.

The MirXT-160 has a footprint of 1650 x 1680 x 1955 mm and is ideal for semiconductors, SMT, photovoltaic, ceramic products, and other special industries.