ICAPE USA

(0 reviews)
  • Type: Manufacturer
  • United States, Indiana, KOKOMO
  • 7654320688
  • 700 E. Firmin St., Suite 208, KOKOMO, Indiana, United States
Since 1999, ICAPE Group has a long experience in the production of Printed Circuit Boards and Customized Technical Parts manufactured in China. In more than 70 countries, 1500 customers trust the quality services and offer of the group. Each month, ICAPE Group delivers 20 million PCBs and 5 million Technical Parts. In 2017, ICAPE Group achieved a revenue of USD 140M and aims for a growth of 20% in 2018. With its teams of 320 people worldwide and 75 strategic partners in Asia, 25 in Printed Circuit Boards and 50 in Technical Parts, ICAPE Group brings the best supply solutions. The service Office is located in China with 185 highly qualified employees. Our global sales organization allows us to be closer to the production plants and to satisfy your needs in Printed Circuit Boards ...show more

PCB Fabrication Capabilities Get PCB Fabrication Quote

Layers

Up to 50 Layers, Metalcore, Flexible and Flex-Rigid

Board Thickness

0.3 to 12mm

Timeline

1 to 5 Weeks

PCB Configuration

Material Brand

Manufacture Type

PCB Assembly Capabilities Get PCB Assembly Quote

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided
  • Double Sided

Assembly Type

  • Mixed
  • Surface Mount
  • Thru Hole

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

  • Prototypes
  • Production

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