What is Polyflon Material?
Polyflon is a thermally stabilized, irradiated polyolefin co-polymer bonding film and is mainly used as a substrate material for stripline packages and multilayer PCBs. The polyflon molecules are inert and as a result, it is challenging to combine them with copper foil. The material requires a unique surface finish to be compatible with the copper foil at the time of PCB manufacturing. This unique treatment is performed through chemical etching on the polyflon surface, which adds to its surface roughness. An adhesive film can also be added to the polyflon surface to improve the adhesion.
Polyflon PCB substrates are known for their low dielectric constant and minimal loss tangent, which makes them suitable for applications at microwave frequencies. The bonding film has a low melting point and hence can be reheated to reflow the bonding film, providing flexibility in manufacturing processes. This material is ideal for use in subsystems for defense, space and commercial applications like military, communications, electronic warfare, radar, and satellite systems.
Advantages of Polyflon
- Low dielectric constant: Polyflon PCBs have a low dielectric constant and low loss tangent at microwave frequencies.
- Low Bonding temperature: Polyflon PCBs have a low bonding temperature that is ideal for temperature-critical applications.
- Re-flow bonding film: The polyolefin thermoplastic bonding film that can be reheated to re-flow bonding film.
- RoHS compliant: Polyflon PCBs are RoHS compliant.
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