PCB ONLINE LTD.

(0 reviews)
  • Type: Manufacturer, Assembly
  • China, Guangdong, Shenzhen
  • +86 0755-27398155 / +86 14737337148
  • Compass No.8299 Shajing Road, Baoan District, Shenzhen, China
We are the structure of the group company - GLOBAL SUCCESS ELECTRONICS GROUP estabilshed in 2000, HongKong. In 2002, we set up factory in Shenzhen, mainly service is prototying and small batch manufacturing. In 2010, we built facto ry focus on multi-layer board and mass production located in JiangSu province.  From the traditional purchase model of PCB/PCBA, we can see that there are problems, such as long delivery cycle, high prices, and chaotic order process that have not been well solved.  PCB ONLINE is one of the e-ecology projects of our company. At present, this project is highly appraised by our customers. Customers can easily order PCBs and related electronic items online. We support prototype manufacturing and mid-volume to mass-volume production runs.  We can produce PCB&...show more

 PCB Fabrication Capabilities

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PCB ONLINE LTD.

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Layers

1 - 24 Layers

Board Thickness

0.15 - 3.2 mm

Timeline

12Hours, 24 hours

Material Brand

PCB Assembly Capabilities

Board Type

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PCB ONLINE LTD.

Board Size

Min 50*50mm Max: 1 buffer is 650*370mm (single clamping) Max: 3 buffer is 500*370mm

Min Component Size

201

Max Component Size

74mm*74mm/50mm*150mm

Stencils

Framework, Non-framework

Fine Pitch

max 112 (Using RF Feeders)

Parts Procurement

3 Days to 2 weeks

Testing

Soldering Type

Package Type

PCB Design Capabilities

Design Services

  • PCB Layout and Design
  • Schematic Entry
  • Panel Design for Manufacturing
  • Other

Design Software

  • PROTEL (Altium)
  • PADS Power PCB
  • ORCAD
  • WG
  • Cadence Allegro
  • Eagle
  • Kicad
  • EasyEda
  • PCBWeb Designer
  • ZenitPCB
  • TinyCAD
  • Osmond PCB
  • ExpressPCB
  • gEDA
  • Fritzing
  • Pad2Pad
  • DesignSpark
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PCB ONLINE LTD.

PCB Stencil Capabilities

Stencil Type

  • Framework
  • Non-Framework

Fiducials

  • Half Lasered on Board Side
  • Half Lasered on Squeegee Side
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PCB ONLINE LTD.

Stencil Type

PCB Repair / Rework Services

  • Circuitry & Pad Damage Repair
  • BGA Rework
  • Trace repair
  • Component repair
  • Pad & Track Repair
  • Solder Mask Repair
  • BGA Reballing
  • BGA Pad Demage Repair
  • Pad-on-Via Repair
  • Gold Plating Rework
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PCB ONLINE LTD.

Capabilites

General
Material(ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-180): ShengYi, ITEQ, KB, Huazheng High Speed FR4, Ceramics & Telflon, Rogers
HDI Stack up1+N+1,2+N+2,3+N+3(with copper filling)
Aspect RatioLaser via 3:4 , PTH 10:1
Final board thickness0.15-3.2mm
Copper thickness1/3-8oz
Impedance Control+/-10%
Line/Space2.5/2.5mil
Min Drill Bit size8mil
Hole size tolerancePTH +/-3mil, NPTH +/-2mil
Hole Position Tolerance+/-2mil
Profile TolerancePuching +/-3mil, Routing +/-4mil
SoldermaskLine to PAD 4mil, Registration +/-2mil
Warpage0.5%
Surface FinishHASL(LF HASL) SMD 40-2000u
RemarksMixed Surface Finishes OSP+ENIG, OSP+HASL; Heavy Copper External layers up to 12oz; Long PCB max 1.5m for DS; (High R) Carbon Available Gold finger Available; Jump V-Cut Available; PCB Edge plating Available; Countersink & Counterbo Available; Sequential lamination Available; Step Routing Available
General
Flexi-rigid PCB1-6 layer
MaterialPolyimide: Taiflex, Shengyi
Final board thickness0.05-0.6mm
Aspect Ratio3:1
Copper thickness1/3-3oz
Impedance ControlSingle Ended +/- 10%; Differential +/- 10%
Line/SpaceInner Layer 1.6/1.6mil; External Layer 1.6/1.6mil
Min Drill Bit size6mil
Hole size tolerancePTH +/-2mil; NPTH +/-1mil
Hole Position Tolerance+/-2mil
CoverlayerLine to PAD 6mil; Registration +/-2mil
Profile TolerancePuching +/-3mil; Laser Cutting +/-2mil
Surface FinishENIG Au 1-5u
General
Base MaterialAluminum(Larid, Ventec,Yugu Boyu), Iron and Copper isolation base
e Max dimension1200*300mm
Copper foil thickness0.5-10oz
Dielectric thickness0.075-0.15mm
Finish Thickness0.5-3.2mm(+/-10%)
line width/Gap1OZ 0.15/0.12MM; 2OZ 0.18/0.15MM; 3OZ 0.25/0.2MM; 4oz 0.3/0.25MM
Soldermask opening0.05mm
Surface finishENIG,OSP,HASL(LF HASL),Immersion Tin,Immersion Silver
Peel strength= 1.8 N/mm
Surface resistance= 1*10^5 M
Volume resistrivity= 1*10^6 M
Sloder fioat260?,10Min ,No layerig,No sparkling
Permittivity= 4.4
Disspation factor= 0.03
Thermal conductivity1.0~4.2W/m.k
Hi-pot Withstand2-6KV
Surface FinishHASL SMD 40-2000u
General
MaterialRogers
Permitivitye2.1-10.0
ProductsRO4350B,RO4450,RO4835,RO3003C,RO3000,RO4000,RO1200
Layer count1-8Layer
Mixed pressureRogers+FR4 , Rogers+AL
Final board thickness0.6-6.0mm
Aspect RatioPTH 8:1
Copper thickness1-2oz
Impedance ControlSingle Ended 50+/- 10%; Differential 90+/- 10%,100+/- 10%
Line/SpaceInner Layer 5/5mil; External Layer 5/5mil
Min Drill size11.81mil
Hole size tolerancePTH +/-3mil; NPTH +/-2mil
Hole Position Tolerance+/-2mil
Profile Tolerance+/-4mil
Solder maskLine to PAD 4mil; Registration +/-2mil
Warpage0.5%
Surface FinishENIG Au 1-5u

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