XPCB Limited

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  • Manufacturer, Assembly, Design, Stencil
  • China, Guangdong, Shenzhen
  • +8614737337148
  • Building 3&4, JinFeng Industry Area, Heping Community, Fuyong Town, Baoan District, Shenzhen, 518103, China

XPCB has been fabricating PCB boards for over 15 years. Our portfolio consists of rigid PCBs, flex PCBs, rigid flex PCBs, Multilayer FPCs and HDI PCBs. We provide sophisticated designs with superior craftsmanship and can deliver PCBs even if you are pressed for time.

Through a talented workforce and advanced facilities, we enable our customers in nearly every electrical-powered industry to transform their idea into a tangible prototype and get-to-market more efficiently. Industries we severed so far have covered aerospace, automotive, consumer electronics, energy solution, IoT, Industrial engineering, Medical, Telecommunication and wireless.

 PCB Fabrication Capabilities

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XPCB Limited


PCB Assembly Capabilities

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XPCB Limited

Time Line General

1, 2, 3, 5 , 7 or 10 Working Days

Prototype Time Line

1, 2, 3 days

Time Line Production

3-10 days

Board Size

Min Board Size: 45mm x 45mm; Max Board Size: 400mm x 1500mm

Board Shape

Rectangular, Circular and any Odd Shapes. (For shapes other than rectangle, you need to panelize the boards in an array, and add break-away rails at the two longer paralleled edges of the panelized boards to ensure that the boards can be assembled by the machine.)

Min Component Size


Max Component Size

01005 (0.4 x 0.2 mm)


Laser cut stainless steel stencils


Conformal coating: Silicone, Acrylic, Urethane, Epoxy

Fine Pitch


BGA Pitch


Parts Procurement

customer-supplied, XPCB supplied


Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSP
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • VGA
  • XFP

File Format

PCB Design Capabilities

Design Software

We design mixed-signal, RF, communication, memory, high layer and high speed PCBs. Our designers closely interact with Vendors and strictly follow your design and DFM specs to accelerate high yield ATE boards

Our team has experience with working for all major test board vendors and ATE IC test system vendors. We have designed boards for versatile ATE templates under different EDA Design tools and are able to provide high yield Design Solutions.

Signal routing of ATE boards is done manually considering PCB stack-up, distance to the reference plane and the power to ground configurations to minimize crosstalk and distortion.

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XPCB Limited

PCB Stencil Capabilities

Stencil Type

We use laser cut stainless steel stencils to ensure high reliability for fine pitch and BGA components. We provide any size of Non-Framework stencils. 

List of common dimensions Framework stencil:

Size XSize YArray XArray Y
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XPCB Limited

Stencil Type

PCB Repair / Rework Services

  • Circuitry & Pad Damage Repair
  • BGA Rework
  • Trace repair
  • Component repair
  • Pad & Track Repair
  • Solder Mask Repair
  • BGA Reballing
  • BGA Pad Demage Repair
  • Pad-on-Via Repair
  • Gold Plating Rework
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XPCB Limited

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