XPCB Limited

XPCB Limited

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  • Manufacturer, Assembly, Design, Stencil
  • China, Guangdong, Shenzhen
  • +86-755-23012705
  • Building 3&4, JinFeng Industry Area, Heping Community, Fuyong Town, Baoan District
  • IATF16949, ISO 14000, ISO 9001, UL
  • Fabrication
  • Assembly
  • Design
  • Stencil
  • Repair/Rework

XPCB Ltd is a high-quality PCB & PCBA OEM manufacturer with extensive experience in the flex circuit board, rigid-flex PCB, ELIC HDI PCB, RF PCB, and multilayer PCB. We offer complete component sourcing, PCB fabrication, and component assembly service under one roof.

With over 21 years experience of in manufacturing PCB in China, we have evolved into a leading PCB supplier with strong expertise in complex rigid-flex circuit boards, flexible PCB, and HDI PCB. Starting from 2000 as a HASL provider, we are now a leading one-stop PCB fabrication company in China. Our business expanded to a full line of PCB fabrication services and gained loyal customers home and abroad with our high product quality and reliable service.

Over the past 21 years, we have consistently upgraded our facility and innovated production methods, to provide quicker lead time and more cost-effective PCB solutions to customers. Intricate stack up and high layer count are our strong position. show more

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Fabrication Capabilities

Assembly Capabilities

No Details Added.
Board Type
Assembly Type
PCB Sides
Time Line General
  • 1, 2, 3, 5 , 7 or 10 Working Days
Board Size
  • Min Board Size: 45mm x 45mm; Max Board Size: 400mm x 1500mm
Board Shape
  • Rectangular, Circular and any Odd Shapes. (For shapes other than rectangle, you need to panelize the boards in an array, and add break-away rails at the two longer paralleled edges of the panelized boards to ensure that the boards can be assembled by the machine.)
Min Component Size
  • 01005(0.4mm*0.2mm)
Max Component Size
  • 0201 or bigger
  • Laser cut stainless steel stencils
  • Conformal coating: Silicone, Acrylic, Urethane, Epoxy
Fine Pitch
  • 0.2mm
BGA Pitch
  • 0.25mm
Parts Procurement
  • customer-supplied, XPCB supplied
Soldering Type
Package Type
File Format
Order Type

Design Capabilities

We have collected Database, design Modeling and experience to meet the getting complicated testing requirement. Such as mix-signal, RF, communication, memory, high layer and high-speed PCB manufacturing.

Our designers closely interact with Vendors and strictly follow your design and DFM specs to accelerate high yield ATE boards

Our team is having vast experience in working for all major test board vendors and ATE IC test system vendors.

We have long experience in designing boards for versatile ATE templates under different EDA Design tools and the ability to provide high yield Design Solutions.

Signal routing of ATE boards are done manually considering PCB stack-up, distance to the reference plane and the power to ground configurations to minimize crosstalk and distortion.




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