Advanced Circuitry International

  • Type: Manufacturer
  • United States, Georgia, Duluth
  • +1 (770) 622-2200
  • 3424 Howell St. Duluth, GA 30096
RF/Microwave & Antenna PCBs. Exotic Material, Teflon Processing Specialists Multi-Layer. Blind/Buried Vias, Via-Fill/Planerize, Backdrill, Low Tolerance Layer to Layer Registration. Specialized Target Plating Processes Large Format PCB Capabilities over 10ft (3.3m) long One of the Largest RF Material Stocks in North America -  Decrease your Lead Times and Price Points, we work with you to be your solutions partner. Celebrating 26 years as a global supplier to the electronics industry: ACI is proud to reliably serve multiple markets, working with some of the most talented minds & companies around the world. Advanced Circuitry International was founded in June of 1992 in Duluth Georgia to manufacture Hi-Tech RF, Microwave and Antenna PCB’s for the Aerospace, Defense, Telecommunications and Medical ...show more
5.0/5.0
Overall
5.0 / 5.0
5.0 / 5.0
5.0 / 5.0
5.0 / 5.0
Likelihood to Recommend:

PCB Fabrication Capabilities

Layers

20+ Layers

Board Thickness

Please Contact Us so we can set up a custom project catered to your needs.

Timeline

Please Contact Us so we can set up a custom project catered to your needs.

PCB Assembly Capabilities

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided

Assembly Type

  • Mixed
  • Surface Mount
  • Thru Hole

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

  • Prototypes
  • Production

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