3-Mil Space Selective Hard Gold PCBs with Full Sidewall Coverage Developed in Just Five Days

Toronto-based PCB fabricator, Candor Circuits, has developed selective hard gold printed circuits boards with full sidewall coverage, at 3-mil spacing in just five days.

The company recently had encountered a larger number of customers that require selective hard gold for contact in connector/bga areas, with via in pad technology. The spacing requirements necessary for these boards require advanced imaging technology to handle the registration, as hard gold does not etch. Candor’s advanced technology and technique allow for consistent etch resist and even allows side walls to be hard gold plated.

Many customers need a quick-turn solution for rapid processing of evaluation boards and prototypes. Candor’s unique process eliminates several steps, which typically add lengthy processing time. This, combined with a simplified process philosophy, allows customers get even their more complex boards on time.

Candor Circuits is a leading technology solution provider for the PCB industry. It is the only manufacturer in the world to have perfected a liquid photo-imageable resist (PiP) in electrolytic form, used for all productions. This allows for panel plating process, which in turn means a highly uniform surface copper distribution, excellent impedance matching results, landless via formation and superior fine line features. Candor strives to continue pushing the boundaries of complex PCB fabrication and encourages anyone with difficult projects to contact them directly for more information about building their boards.

Source: iConnect007

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