ASMPT Showcases Intelligent Factory Solutions and Debut New Placement Platoform at NEPCON Thailand 2026

ASMPT Showcases Intelligent Factory Solutions and Debut New Placement Platoform at NEPCON Thailand 2026712370

ASMPT is exhibiting at NEPCON Thailand in the Bangkok International Trade & Exhibition Centre (BITEC). The event is a trade fair for assembly, measurement and testing technologies in electronics manufacturing and is taking place from June 17 to 20, 2026. ASMPT will be showcasing solutions for the intelligent factory at Booth 0D11 in Hall 100. As a highlight, the new SIPLACE V placement platform will be unveiled for the first time in Thailand.

With the SIPLACE V platform, newly developed from the ground up, ASMPT is introducing a placement platform focused on performance, flexibility, and process quality. Independent field tests conducted under real-world production conditions have demonstrated performance gains of up to 30 percent in sectors of electronics manufacturing, including automotive, consumer electronics, smartphones, and IT and network infrastructure. The SIPLACE V combines speed with precision and flexibility.

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SIPLACE V

More Speed and Precision

The SIPLACE V features a machine frame and linear drives as well as measurement systems with enhanced resolution. This enables higher acceleration and greater accuracy. The platform supports both single- and dual-lane configurations, Smart Pin support, and high-density placement of complex assemblies.

“With the new SIPLACE V, we are providing electronics manufacturers with a platform that integrates seamlessly into existing production environments while laying the groundwork for future automation and AI applications,” explains Sopchock Yuttawong, General Manager at ASMPT SMT Solutions Thailand. “This enables companies to modernize their manufacturing in a targeted manner while ensuring that their investments remain secure in the long term.”

Software and Intelligent Connectivity

In addition to hardware, ASMPT is showcasing software and service solutions for intelligent manufacturing with applications from the WORKS Software Suite as well as the Factory Solution SMT Analytics. These solutions collect and analyze production data in real time, identify deviations early on, and help electronics manufacturers improve productivity, quality, and line performance.

WORKS Optimization integrates data from printing, placement, SPI, and AOI processes across the SMT line, detects process deviations and recurring defect patterns at an early stage, and provides recommendations. In solder paste printing, optimizations can be carried out automatically to stabilize processes and reduce scrap. WORKS Monitoring visualizes production metrics in real time and provides detailed views down to the line or machine level. This is complemented by SMT Analytics, which compares production data from different lines, identifies bottlenecks, and reveals optimization potential using AI-powered analyses.

Closed-Loop Nozzle Management

Another highlight is ASMPT’s closed-loop nozzle management system. Using RFID-equipped “smart nozzles” and condition monitoring, the application controls maintenance, cleaning, and nozzle replacement automatically and as needed. When combined with the Factory Equipment Center and the Smart Nozzle Station, it helps improve process stability and product quality while reducing unplanned downtime.

Digital Services and AI-Powered Support

In the service area, ASMPT is showcasing offerings such as the Customer Portal and the Virtual Assist application, an AI-powered expert system designed to support service and maintenance for technicians.

During the trade show, daily live presentations will be held showcasing the SIPLACE V. Visitors will gain insights into placement processes, software functions, and solutions for high-mix and high-throughput manufacturing environments at the ASMPT booth.

Click here to learn more about the ASMPT.

Publisher: PCB Directory
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