Amphenol Ardent Introduces High-Density Compression OEM Interconnects for 56G and 112G Systems and Beyond

Amphenol Corporation subsidiary, Amphenol Ardent Concepts has launched its newest line of solderless compression mount connectors, the micro-LinkOVER™ (P/N: mLO-XXXXX) Series. It is an OverPass™ twin axial connector system that provides system designers and layout engineers a cost-effective approach to unlock the design flexibility needed to manage the technical challenges of 56G and 112G systems and beyond.

The micro-LinkOVER supports 10Gb/s, 28Gb/s, 56Gb/s, and 112Gb/s PAM4 per lane signaling speeds with high signal-to-noise ratio and low VSWR. It’s direct-to-PCB compression mount solution eliminates the need for any lossy paddle cards, minimizing transitions and losses on system budgets. micro-LinkOVER’s modular design allows for multiple form factors in dense footprints to fit in crowded real estate environments. “We leveraged our experience designing and building reliable signal integrity connectors with compression mount technology in the near chip connector world to provide a connector capable of supporting current and upcoming 56G and 112G designs and beyond as customers think ahead towards 224G,” said Gordon Vinther, Ardent’s Managing Director.

Designs of micro-LinkOVER are available for both chip perimeter and direct-to-substrate applications. The micro-LinkOVER is an ideal solution for 100G/200G/400G Systems, lnfiniband™, PCle®, Chip-to-Chip links, and 5G systems. Furthermore, a low profile (4.2mm mated height) gives designers the added flexibility needed to escape under heat sinks and from the bottom side of PCBs to minimize trace loss by getting closer to devices.

The micro-LinkOVER connectors are designed to be paired with Amphenol’s extensive line of external interfaces and cabled backplane interfaces. “As our customers drive towards 112G PAM4 and beyond, micro-LinkOVER is an ideal near-chip/on-package connector for internal cabled hosts, or paired with our latest generation OSFP and QSFP DD connectors, to solve the most complex electrical and mechanical packaging issues. Through its innovative direct cable to host termination, micro-LinkOVER is packaged in an extremely low mechanical profile allowing placement under heatsinks and as close to ASICs as possible. The optimized signal path delivers best in class signal integrity with excellent return loss performance,” said Brian Kirk, Director of Engineering, for Amphenol High Speed IO.

About Amphenol Ardent Concepts

Amphenol Ardent Concepts, is a division of Amphenol Corporation, one of the world’s largest designers, manufacturers and marketers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. Amphenol Ardent Concepts is a leading designer and manufacturer of high performance multi-coax and twinax assemblies, probes, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Its core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. It is used to connect integrated circuits and printed circuit boards to instrumentation and to each other offering superior signal integrity in a high-speed environment. Markets for products include: Semiconductor, Test & Measurement, Military/Aerospace, Communications and Medical.

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