Atotech Exhibits its Latest Innovative Solutions at IPC APEX EXPO 2020

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Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, is exhibiting in the largest event for electronics manufacturing in North America - IPC APEX EXPO 2020, at the San Diego Convention Center from February 4 - 6. Atotech experts are presenting and discussing the company’s latest innovative solutions, electronics industry outlook and technological trends, as well as participating in the conference program with five presentations:

Visitors to the event are welcome to join the Atotech technical conference talks and get exclusive product insights from the experts directly at the conference or at any time at the company’s booth: 4215.

Atotech’s key Highlights at the Booth Include:

• ViaKing – A new enhanced graphite direct metallization for flex and advanced base materials.
• Printoganth P2 – A universal horizontal e’less Cu system for flex, flex-rigid, HDI & MLB base materials.
• Printoganth TV – High throwing power electroless copper for vertical processing of HDI amSAP PCBs.
• CupraPulse IN – Vertical conformal pulse plating with insoluble anodes.
• InPro MVF2 – Next-generation BMV filling in VCP for HDI production.
• Inpro RA – A new high current density BMV filling for high productivity in flex manufacturing.
• Aurotech G-Bond – Autocatalytic Au for ultimate bondability.
• PallaBond – A new direct pure EPAG surface finish for ultra-fine L/S application.
• Stannatech SF8 – New optimized immersion tin process developed to improve vertical processing.
• BondFilm HF – Bonding enhancement solutions for low signal loss with high frequency applications.
• Novabond EX – A new generation adhesion promotor for advanced IC packaging.
• CupraEtch SR8000 – Advanced pretreatment for dry-film and solder mask adhesion.
• Silvertech HS – Selective Ag plating for lead frames and LED lead frames.
• Argalin XL – High-performance inorganic and Cr(VI)-free silver anti-tarnish process.
• Spherolyte Cu UF3 – High purity ECD Cu process for high-speed plating of pure Cu for pillar application.
• Spherolyte   SnAg – SnAg for solder bumping and pillar capping.

Click here to view more highlights from IPC APEX EXPO 2020.