Atotech to Exhibit Latest Product Innovations at NEPCON Japan 2020

Atotech, a leading global supplier of specialty chemicals and equipment for the printed circuit board and package substrate markets, will present at the 34th Electronics R&D, Manufacturing and Packaging Technology Expo- NEPCON Japan 2020. The event will be held at the Tokyo Big Sight, Japan, from 15th - 17th January.

Atotech’s Key Highlights at NEPCON JAPAN Include:

  • vPlate – New vertical continuous copper plating equipment for advanced HDI and IC substrate.
  • Polygon PLB Line – New desmear and electroless copper metallization equipment.
  • ViaKing – A new enhanced graphite direct metallization process for flex and advanced base materials.
  • Printoganth P2 – A new universal horizontal e’less Cu system for flex, flex-rigid, HDI & MLB base materials.
  • InPro SAP3 – IC substrate via filling process for best uniformity at high current density.
  • InPro PI – Copper pillar plating process for high interconnect density.
  • PallaBond – A new direct pure EPAG surface finish for ultra-fine L/S application.
  • Stanna-COF – Immersion tin process for chip-on-film applications.
  • CovaBond P100 – Adhesion promoter for plating on polyimide COF, flex HDI, mSAP, SAP.
  • Novabond EX – A new generation adhesion promoter for advanced IC substrate manufacturing.
  • AgPrep – Ultimate non-etching adhesion promoter for silver surfaces.
  • Argalin XL – High-performance inorganic and Cr(VI)-free silver anti-tarnish process.
  • Spherolyte UF3 – High-speed copper deposition for pillar applications.
  • Xenolyte NI TR – High-temperature resistant Ni for RDL and pad metallization.

Click here to view more highlights from the event.

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