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Test Research, Inc. (TRI) has announced its participation in productronica China 2025, occurring March 26–28, 2025, at the Shanghai New International Expo Centre (SNIEC), Shanghai. Visit TRI at Hall E5, Booth #5328, to experience the latest Advanced Packaging and Electronics Manufacturing Inspection innovations.
TRI will showcase the latest back-end inspection solutions, TR7007Q SII-S and TR7700Q SII-S. The TR7007Q SII-S can inspect Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection applications. The AI-powered 3D SEMI AOI, TR7700Q SII-S, can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more.
Also presenting at productronica China 2025 will be the High-Resolution 3D CT AXI TR7600F3D LL SII for multiple industry applications and the High-Pin Count board tester, TR8001 SII.
The AI-powered solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI solutions comply with the latest Smart Factory standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Visit TRI's booth at Hall E5, Booth #5328, to discover why the industry-leading EMS companies trust TRI as their Test and Inspection Partner.
Click here to learn more about productronica China 2025.
Click here to learn more about Test Research.
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