Ventec Expands its Manufacturing Capabilities for the Growing Demand of PTFE Laminates

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PCB experts, Ventec has announced the significant increase in their PTFE laminate manufacturing capabilities following with a strategic investment in a new state-of-the-art high-temperature press and lay-up/break-down line at its Suzhou (China) manufacturing plant.

With 5G and evermore sophisticated radar applications, the demand and requirements for low loss/high-frequency material is accelerating. Critical RF/Microwave-, antenna-, power amplifier- and sub-assembly-applications require superior electrical performance that can be delivered through PTFE laminates.

To serve the increasing demand for these PTFE type products, Ventec has strengthened its investment in its Suzhou manufacturing plant to be even better positioned for the increase in demand and to meet the customer's accelerated radar and 5G deployment requirements.

The most recent and important equipment investment in Ventec’s Suzhou (China) manufacturing plant has resulted in a significant increase in manufacturing capacity to meet the growing demand for PTFE laminates. This includes the launch and roll-out of tec-speed 30.0 - Ventec’s latest ceramic filled high-speed/high-frequency PTFE material range that offers the highest signal-integrity characteristics for the most advanced high-frequency systems such as 77~79 GHz automotive radar systems.

tec-Speed 30.0 (VT-3703) Offers:

• Dk 3.0 with extremely low Df (0.0009)
• DK-stability versus temperature
• Lower in-plane thermal expansion

The current Dk 3.0 tec-speed 30.0 version will be supplemented by Dk 6.15 and Dk 10.2 versions in the first half of 2020, offering an even wider range of options for applications such as automotive radar, cellular base stations, power amplifiers & antennas, global positioning satellite antennas, patch antennas for wireless communication or power back-planes.