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PCB Spotlight: Top PCB Capabilities

12 Feb, 2026 Newsletter - PCB Directory

PCB Company Capabilities in Focus. View it in your browser

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PCB Spotlight
Date: 12 Feb, 2026
 
Sponsored by ECTC 2026
 
 
PCB Capabilities Spotlight
Innovative Semi-Additive Process Technology from GS Supports PCB Line Spacing Down to 10 microns
Capability
Innovative Semi-Additive Process Technology from GS Supports PCB Line Spacing Down to 10 microns
GS Swiss PCB AG
GS Swiss PCB has been at the forefront of advancing printed circuit board (PCB) manufacturing technology to meet the growing demands of miniaturization in electronics. Recognizing the limitations of traditional subtractive methods, which are restricted to lines and spaces of around 30 micrometers, GS Swiss PCB began developing Semi-Additive Process (SAP) technology in 2019 and invested heavily in state-of-the-art equipment and cleanroom facilities. Read More
Graphite Core PCBs from Teledyne Labtech Offer Superior Thermal Conductivity for Modern Electronic Devices
Capability
Graphite Core PCBs from Teledyne Labtech Offer Superior Thermal Conductivity for Modern Electronic Devices
Teledyne Labtech
Teledyne Labtech offers advanced graphite core PCBs that are designed to deliver superior thermal conductivity for demanding electronic applications. By efficiently dissipating heat, these graphite core circuit boards support higher performance, improved reliability, and more compact designs in thermally sensitive electronic systems. Read More
Extended Length Flex Circuit Solutions from All Flex for Catheter Design and Medical Devices
Capability
Extended Length Flex Circuit Solutions from All Flex for Catheter Design and Medical Devices
All Flex Solutions
All Flex Solutions is redefining what is possible in catheter design with its Catheter Flexible Circuits, a purpose-built solution engineered for today’s most demanding medical devices. Designed to support longer, more complex catheter assemblies while maintaining reliability and precision, these flexible circuits play a critical role in improving device performance and manufacturability. Read More
KSG Offers Iceberg® PCB Solutions with High Current Handling and Heat Dissipation Capabilities
Capability
KSG Offers Iceberg® PCB Solutions with High Current Handling and Heat Dissipation Capabilities
KSG GmbH
KSG offers Iceberg® PCB solutions specifically developed to handle high currents and increased heat dissipation in today’s increasingly powerful electronic systems. By using thick copper structures with mixed copper thicknesses ranging from 105 to 400 µm in the outer layers and maintaining a uniform surface topography, KSG enables the efficient combination of high current paths and fine conductors within multilayer designs. Read More
Sponsored by ECTC 2026
ECTC 2026
IEEE Electronic Components & Technology Conference (ECTC) in Orlando, Florida: May 26-29
ECTC is the premier international event for microelectronics packaging, components, systems, science, technology, & education, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. Click here to learn more.
Additive Circuits Technologies Implements Advanced Additive PCB Manufacturing Processes
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Additive Circuits Technologies Implements Advanced Additive PCB Manufacturing Processes
Additive Circuits, Inc
Additive Circuits Technologies (ACT) has positioned itself at the forefront of next-generation electronic interconnect manufacturing with its proprietary additive metallization technologies for advanced printed circuit boards and electronic structures. The company develops and implements unique processes that enable a wide range of conductive materials to be precisely applied onto novel and high-performance dielectric surfaces. Read More
Bench 2 Bench Technolgies Delivers Micron-Scale Precision in UHDI Flexible Circuits
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Bench 2 Bench Technolgies Delivers Micron-Scale Precision in UHDI Flexible Circuits
Bench 2 Bench Technologies
Bench 2 Bench Technologies operates with a focused premise: ultra-high-density interconnect (UHDI) flexible circuits demand specialized engineering, precise handling, and close technical collaboration. The company’s approach emphasizes understanding application requirements early, enabling informed recommendations on materials, finishes, and manufacturing processes tailored to each design. Read More
COFAN Provides Ultra-RF Ceramic MCPCBs™ for High-Frequency and High-Power RF Applications
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COFAN Provides Ultra-RF Ceramic MCPCBs™ for High-Frequency and High-Power RF Applications
COFAN USA
Standard FR-4 PCBs and conventional MCPCBs often degrade radio signals by introducing noise and electromagnetic interference (EMI). To solve this issue, COFAN developed the Ultra-RF Ceramic MCPCB™, an advanced metal-core printed circuit board designed for high-frequency and high-power RF applications. With low dielectric impedance ceramic materials and customizable copper layers, this technology ensures minimal signal loss, superior impedance control, and efficient thermal management. Read More
Technotronix Manufactures High-Tg PCBs for Applications Involving Demanding Thermal Environments
Capability
Technotronix Manufactures High-Tg PCBs for Applications Involving Demanding Thermal Environments
TechnoTronix
Technotronix develops and manufactures high-Tg printed circuit boards engineered for elevated temperature performance. These high-temperature PCBs are designed to maintain structural integrity, electrical reliability, and dimensional stability even under sustained thermal stress. As electronic systems continue to operate in increasingly demanding thermal environments, the importance of high-temperature printed circuit boards has become more pronounced. Read More
Sponsored by ECTC 2026
 
 
Heavy Copper PCB Manufacturing and Assembly at Bittele Electronics
Capability
Heavy Copper PCB Manufacturing and Assembly at Bittele Electronics
Bittele Electronics Inc
Bittele Electronics provides manufacturing and assembly services for heavy copper PCBs, supporting designs that incorporate increased copper thickness on internal and external layers. Heavy copper printed circuit boards are used in electronic applications that require high current capacity, enhanced thermal performance, and long-term reliability under electrically and thermally demanding conditions. Read More
AdvancedPCB Highlights Laser-Drilled Microvia Capabilities for High-Density PCB Designs
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AdvancedPCB Highlights Laser-Drilled Microvia Capabilities for High-Density PCB Designs
AdvancedPCB
AdvancedPCB has highlighted its capabilities in laser-drilled microvia technology, underscoring its continued investment in advanced manufacturing processes for high-density and mission-critical printed circuit board applications. The company provides PCB manufacturing services ranging from simple prototypes to complex, high-layer-count designs for demanding and high-volume production environments. Read More
Cirexx Offers HDI PCB Fabrication & Manufacturing Services Using Advanced Production Equipment
Capability
Cirexx Offers HDI PCB Fabrication & Manufacturing Services Using Advanced Production Equipment
Cirexx International Inc
Cirexx provides high-density interconnect (HDI) PCB fabrication and manufacturing services, addressing the growing demand for compact, high-performance circuit boards across industries such as medical, aerospace, defense, and consumer electronics. HDI technology is now widely used in smartphones, tablets, and other space-constrained digital devices where signal integrity, reliability, and miniaturization are critical. Read More
Piher Sensing Systems’ Advanced Printed PCB Resistor Technology for Integrated Electronics
Capability
Piher Sensing Systems’ Advanced Printed PCB Resistor Technology for Integrated Electronics
Piher Sensing Systems continues to expand the possibilities of integrated electronics with its advanced printed PCB resistor technology. Leveraging market-leading thick-film processes, Piher enables the direct deposition of fixed resistors, potentiometer tracks, switches, and conductors onto PCBs of virtually any size, shape, or form. This high level of versatility allows designers to create compact, highly integrated solutions at a competitive cost, even for low-volume production runs. Read More
The World Battery & Energy Storage Industry Expo 2026
Event
The World Battery & Energy Storage Industry Expo 2026
Date: September 16–18, 2026
Location: Guangzhou, China
AT&S’s 2.5D® Technology Allows Creation of Cavity PCBs that are Extremely Miniaturized and Thin
Capability
AT&S’s 2.5D® Technology Allows Creation of Cavity PCBs that are Extremely Miniaturized and Thin
AT&S
AT&S takes printed circuit board design to the next level with its innovative 2.5D® cavity PCB technology, enabling more compact, flexible, and high-performance electronic systems.Redefining PCB Design with 2.5D® TechnologyThe 2.5D® cavity printed circuit boards from AT&S introduce a new way of utilizing space within multilayer PCBs. By creating precisely defined recesses (or cavities) within individual PCB layers, components can be positioned lower inside the board rather than mounted only on the surface. Read More
Technomark Provides Precision Laser Cutting for Advanced PCB Applications
Capability
Technomark Provides Precision Laser Cutting for Advanced PCB Applications
As printed circuit boards continue to evolve in complexity, precision manufacturing processes have become essential. Technomark leverages advanced laser cutting technologies to support the demanding requirements of modern PCB applications, delivering accuracy, flexibility, and efficiency without the limitations of traditional hard tooling. Technomark’s laser systems are designed to cut, etch, drill, and process intricate PCB materials with exceptional precision. Read More
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PCB Directory is the largest directory of PCB Manufacturers and Fabricators on Internet. We have listed the leading Printed Circuit Board manufacturers around the world and made them searchable by their location and their capabilities.
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