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PCB Equipment Digest: New and Interesting Products

19 Feb, 2026 Newsletter - PCB Directory

New and Interesting PCB Products. View it in your browser

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Equipment Digest
Date: 19 Feb, 2026
 
Sponsored by Focus on PCB
 
 
New and Interesting Products
PCB Component Counter
X-ray Component Counter for SMD Components
PCB Component Counter  from CORE- EMT
The Seamark XC1000 from CORE-EMT is an X-ray Component Counter that uses AI-powered algorithms to count SMD components automatically. It has an accuracy of 99.99% and can detect SMD components as small as 0.4 x 0.2 mm (01005). This component counter has a 30-80 kV X-ray tube and a 427x 427 mm X-ray flat panel detector with a resolution of 3.6 Lp/mm.
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Pick and Place Machine
Pick and Place Machine with Placement Speed of up to 105,000 CPH
Pick and Place Machine  from ASMPT GmbH & Co. KG
The SIPLACE V from ASMPT GmbH & Co. KG is a Pick and Place Machine that has a placement speed of up to 105,000 CPH. It has an accuracy of up to ±25 µm @ 3 σ and can handle PCB dimensions of up to 850 x 610 mm (single-lane mode), 400 x 280 mm (dual lane mode) & 700 x 530 mm (dual as single mode). This equipment has a footprint of 1.1 x 2.4 x 1.6 m.
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PCB Design Software
Electronic Systems Design Software for PCB Development
PCB Design Software  from Siemens
Xpedition from Siemens is an Electronic Systems Design Software that is designed for professional printed circuit board development. It supports schematic capture, hierarchical design, constraint-driven layout, and advanced routing automation in a single environment. This platform integrates component management, cloud-connected collaboration, and AI-assisted design productivity to help teams handle simple to complex boards with native 3D visualization and cloud access throughout the workflow.
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Solder Paste
Lead-Free Solder Paste Composed of SnAgCu Alloy
Solder Paste  from MATSUO HANDA CO.,LTD
The FLF01-LBM from MATSUO HANDA CO., LTD. is a Lead-Free Solder Paste that is composed of SnAgCu alloy. It has 86% Cu content & 83% Ni content and has Type 4 (20 to 38 µm) & Type 5 (15 to 25 µm) sized particles. This solder paste uses MATSUO's proprietary activating agent technology to secure a wide range of active temperature ranges to improve heat resistance. It is available in 500g jar containers.
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Reflow Soldering Equipment
Reflow Soldering Equipment with 10/10 Heating Zones
Reflow Soldering Equipment  from BTU International, Inc
The AURORA 125N50 from BTU International, Inc. is a Reflow Soldering Equipment that has a 10 heating zones in the top and bottom each. It has a heating element of length 3175 mm and 4 cooling zones of length 1270 mm. These heating and cooling zones are factory-configurable to tailor the system to handle heavy boards, slow cooling needs, or high-throughput lines.
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Pick and Place Machine
Pick and Place Machine with Placement Speed of up to 50,000 CPH
Pick and Place Machine  from Juki Americas
The RS-2 from Juki Americas is a Pick and Place Machine that has a placement speed of up to 50,000 CPH. It uses Takumi Head Technology that delivers a placement accuracy of ±35μm and supports component sizes ranging from 0.3 x 0.15 mm (03015) to 50 x 150 x 74 mm. This machine can handle PCB sizes of 50 x 50 mm to 800 x 370 mm and a board thickness of 0.3 to 6.0 mm.
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In-Circuit Tester
Portable In-Circuit Test System with Kelvin Measurement Capability
In-Circuit Tester  from Digitaltest Inc.
The Sparrow MTS 30 from Digitaltest is an In-Circuit Test System designed to provide high level of flexibility and test capability in a small footprint. It supports analog and digital testing of circuits with multiple test options. This system utilizes low voltage technology with an AMU module for ICT measurements, a MUX module, hybrid digital driver/sensors, and integrated power supplies. This tester equipment has a voltage measurement range of 0 to 100 V and a current measurement range of up to 100 mA.
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Solder Paste Printer
Solder Paste Printer with Print Speeds up to 200 mm/s
Solder Paste Printer  from Fuji America Corporation
The GPX-CW from Fuji America Corporation is a Solder Paste Printer that prints at a speed of up to 200 mm/s. It has a printing accuracy of ±0.018 mm and supports metal mask frame sizes 550 mm (L) x 380 to 800 mm (W). This solder paste printer supports panel sizes of 48 x 48 mm to 370 x 580 mm (single lane) & 48 x 48 mm to 370 x 305 mm and panel loading time of 6.0 s. It supports ultra fine patterns as small as 0201 mm and has the durability to maintain printing quality.
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Pick and Place Machine
Pick and Place Machine with Placement Speed of up to 4800 CPH
Pick and Place Machine  from DDM Novastar Inc
The LS60 from DDM Novastar Inc. is a Pick and Place Machine that has a placement speed of up to 4800 CPH. It supports component sizes ranging from 1.6 x 0.8 mm (0603) to 35 mm and PCB sizes up to 343 x 813 mm with a board thickness ranging from 0.5 to 4.0 mm. This machine supports up to 96 8 mm tape feeders and all SMT components including discretes, SOICs, PLCCs, QFPs, and BGAs.
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Upcoming Event
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electronica India 2026
Date: April 8-10, 2026
Location: Greater Noida, India
More Events
Sponsored by Focus on PCB
Focus on PCB 2026 - May 2026, Vicenza, Italy
Conferences & Technical Insights at Focus on PCB 2026 - May 2026, Vicenza, Italy
Alongside the exhibition, Focus on PCB 2026 offers a rich conference programme with expert talks, panels and technical sessions focused on trends, challenges and innovations in PCB and electronics manufacturing. Click here to learn more.
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