|
No Details Added.
|
| PCB Board | - Rigid
- Flexible
- Rigid-flex
- HDI
- Hybrid PCB
- Burn-In
| Order Type | - Prototypes
- Production
| PCB Configuration | - Single Sided
- Double Sided
| Layers | | | Board Thickness | - Rigid: 0.2 to 8.0 mm, FPC: 0.13mm
| | Timeline | | | Board Dimensions | |
| PCB Type | - RF
- High Tg
- Aluminium
- Metal-based
- Copper
- Halogen-free
- Ceramic
| Material | - CEM-2
- CEM-3
- Duroid
- FR-1
- FR-2
- FR-4
- FR-5
- Kapton
- Polyester
- Polyethylene
- Polyflon
- Polyimide
- Teflon
- FR-3
| Material Brand | - Arlon
- Dupont
- Isola
- Iteq
- Kingboard
- Nanya
- Nelco
- Neltec
- Panasonic
- Rogers
- Taconic
- Ventec
- Metclad
- Shengyi
Capabilites
| Rigid PCB |
|---|
| Layers | 1-100 Layers | | Material | FR4(TG130C),FR4(TG150C),FR4(TG170),Aluminum(5052,1.0w/mk) | | Board Thickness | 0.2~4.0mm | | Copper thickness | 0.5oz - 20oz(18um - 210um) | | Inner Layer copper Thickness | 0.5oz - 6oz(18um - 70um) | | Max Board size | 1200x700mm | | Min Tracing/Spacing | 3.0mil/3.0mil | | Min Annular Ring | 3mil | | Min Drilling Hole diameter | 0.2mm(8mil),0.1mm(4mil)-laser drill | | Solder mask | Green,green matte,Black,Black matte,White,Red,Yellow,Blue,Purple,Transparent | | Silkscreen | White,Black,Blue,Red,Yellow | | Surface finish | HASL with Lead,Free Lead HASL,ENIG,Immersion silver,Immrsion Tin,OSP,Hard gold | | Surface/Hole plating thickness | 20-30um | | Board thickness tolerance | ±0.1mm(±10%) | | Board dimension tolerance | ±0.1mm ~ ±0.3mm | | PTH hole tolerance | ±0.03 | | NPTH hole tolerance | ±0.02 | | Impedance tolerance | ±5% ~ ±10% | | SMD Pitch | 0.2mm(8mil) | | BGA Pitch | 0.2mm(8mil) | | Aspect Ratio | 1:40 | | Chamfer of gold finger(Contact) | 20,30,45,60 | | Testing | 10V-250V,fly-probe or testing fixture | | Others Techniques | Gold fingers,Blind/Buried hole,peelable soldermask,Edge plating,Carbon mask,Kapton tape,Countersink/counterbore hole,Press fit hole,Via tented/covered with resin,Via plugged/filled with resin,Via in pad |
| FPC |
|---|
| Standard size | 250mm*1500mm | | Line Width & Spacing | 0.08mm | | Drill Hole | 0.1mm | | Laser Hole | 0.05mm | | Raw material | PI /FR4 /LCP/PET/STEEL | | Solder mask bridge between dam | 0.1mm | | TG | 130-170 | | Etching H/W/space | 0.02mm/0.1mm/0.1mm | | testing | OAI/ CMM/ Slice /microscope/E-test/ fly test | | surface finished | ENIG/Silver/copper/codon |
| Rigid-flex |
|---|
| Standard size | 250*500mm | | Line width and spacing | 0.1mm | | Lay count | 6 up | | Min Drill hole and Laser hole tolearn | 10% | | raw material | PI, LCP, FR4, STEEL, PET | | solder mask | 0.1mm | | TG | 130/170 | | Etching H/W/space | 0.03mm, .01mm, 0.1mm | | testing | OAI,CMM,SLICE,E-TEST,FLY-TEST,MIROCSCOPE |
| Material |
|---|
| RO4003C | 3.38±0.04 @10 GHz | | RO4350B | 3.48±0.05 @10 GHz | | RO4350B | 10.2±0.03 @10 GHz | | Impedance Control |
|---|
| Yes | Yes | | Burried Vias |
|---|
| Yes | Any layer | | Blind Vias |
|---|
| Yes | Any layer |
|
|
|
|
|
|
|
