MultiTech Electron HK Ltd

MultiTech Electron HK Ltd

  • Manufacturer, Assembly, Stencil, Repair
  • China
  • +86-13249262197
  • 6F, Xingzhongbao Business Building, Fuyong Road, Fuyong Town, Bao'an District
  • ISO 9001:2015, RoHS, UL
  • Fabrication
  • Assembly
  • Design
  • Stencil
  • Repair/Rework

With the development, our services include PCB, SMD/THT assembly, SMD stencil, wires, components purchasing and switch panel etc.

Multitech Electron HK Limited is a High-end PCB manufacturer in China with a long-standing tradition of quality and excellence. The company produces PCBs with up to 100 layers, an aperture of up to 0.1 mm, max board thickness of up to 8.0 mm, a max copper thickness of 20oz and a min line width/line space of 2.0/2.0mil. We have abundant experience in making Heavy Copper PCBs, Mixed PCBs, High-Frequency PCBs, High TG, HDI PCBs and any layer of Blind/Burried vias PCB and Semi-flex PCBs, Flexible PCB, Rigid-flex PCBs etc.

With 18 years of experience in high precision and difficulty circuit boards, we continue to provide innovative services for autopilot, aerospace applications, communications and medical equipment.

For more information on technology, please feel free to contact us to get a quote and professional technical service.

We are there for you.

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PCB Repair / Rework Services

No Details Added.
Repair Service Required


Stencil Capabilities

No Details Added.
Stencil Type
Stencil Fiducials

Thickness: 0.12mm, 0.15mm

Type: Top, Bottom, Top&Bottom on one panel

Fabrication Capabilities

No Details Added.
PCB Board
Order Type
PCB Configuration
Layers
  • Up to 100 Layers
Board Thickness
  • Rigid: 0.2 to 4.0 mm, FPC: 0.13mm
Timeline
  • 4 - 15 Days
Board Dimensions
  • 1200 x 600 mm
PCB Type
Material
Material Brand

Capabilites

Rigid PCB
Layers1-100 Layers
MaterialFR4(TG130C),FR4(TG150C),FR4(TG170),Aluminum(5052,1.0w/mk)
Board Thickness0.2~4.0mm
Copper thickness0.5oz - 20oz(18um - 210um)
Inner Layer copper Thickness0.5oz - 6oz(18um - 70um)
Max Board size1200x700mm
Min Tracing/Spacing3.0mil/3.0mil
Min Annular Ring3mil
Min Drilling Hole diameter0.2mm(8mil),0.1mm(4mil)-laser drill
Solder maskGreen,green matte,Black,Black matte,White,Red,Yellow,Blue,Purple,Transparent
SilkscreenWhite,Black,Blue,Red,Yellow
Surface finishHASL with Lead,Free Lead HASL,ENIG,Immersion silver,Immrsion Tin,OSP,Hard gold
Surface/Hole plating thickness20-30um
Board thickness tolerance±0.1mm(±10%)
Board dimension tolerance±0.1mm ~ ±0.3mm
PTH hole tolerance±0.03
NPTH hole tolerance±0.02
Impedance tolerance±5% ~ ±10%
SMD Pitch0.2mm(8mil)
BGA Pitch0.2mm(8mil)
Aspect Ratio1:40
Chamfer of gold finger(Contact)20,30,45,60
Testing10V-250V,fly-probe or testing fixture
Others TechniquesGold fingers,Blind/Buried hole,peelable soldermask,Edge plating,Carbon mask,Kapton tape,Countersink/counterbore hole,Press fit hole,Via tented/covered with resin,Via plugged/filled with resin,Via in pad
FPC
Standard size250mm*1500mm
Line Width & Spacing0.08mm
Drill Hole0.1mm
Laser Hole0.05mm
Raw materialPI /FR4 /LCP/PET/STEEL
Solder mask bridge between dam0.1mm
TG130-170
Etching H/W/space0.02mm/0.1mm/0.1mm
testingOAI/ CMM/ Slice /microscope/E-test/ fly test
surface finishedENIG/Silver/copper/codon
Rigid-flex
Standard size250*500mm
Line width and spacing0.1mm
Lay count6 up
Min Drill hole and Laser hole tolearn10%
raw materialPI, LCP, FR4, STEEL, PET
solder mask0.1mm
TG130/170
Etching H/W/space0.03mm, .01mm, 0.1mm
testingOAI,CMM,SLICE,E-TEST,FLY-TEST,MIROCSCOPE
Material
RO4003C3.38±0.04 @10 GHz
RO4350B3.48±0.05 @10 GHz
RO4350B10.2±0.03 @10 GHz
Impedance Control
YesYes
Burried Vias
YesAny layer
Blind Vias
YesAny layer

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