MultiTech Electron HK Ltd

MultiTech Electron HK Ltd

  • 301, Building E5, North Industrial Park, Yanchuan Community, Yanluo Street, Bao 'an District
  • China, Baoan District, Shenzhen
  • +86-13249262197
  • ISO 9001:2015,RoHS, UL

What can we do for you?

With the development, our services include PCB, SMD/THT assembly, SMD stencil, wires, components purchasing and switch panel, etc.

Multitech Electron HK Limited is a High-end PCB manufacturer in China with a long-standing tradition of quality and excellence. The company produces PCBs with up to 100 layers, an aperture of up to 0.1 mm, a max board thickness of up to 8.0 mm, a max copper thickness of 20oz and a minimum line width/line space of 2.0/2.0mil. We have abundant experience in making Heavy Copper PCBs, Mixed PCBs, High-Frequency PCBs, High TG, HDI PCBs and any layer of Blind/Burried vias PCB and Semi-flex PCBs, Flexible PCBs, Rigid-flex PCBs etc.

With 18 years of experience in high precision and difficulty circuit boards, we continue to provide innovative services for autopilot, aerospace applications, communications and medical equipment.

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Supported PCB Services

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Fabrication Capabilities

This company provides PCB Fabrication services.
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PCB Board
Order Type
PCB Configuration
Layers
  • Up to 50 Layers
Board Thickness
  • Rigid: 0.2 to 8.0 mm, FPC: 0.13mm
Timeline
  • 4 - 15 Days
Board Dimensions
  • 1200 x 600 mm
PCB Type
Flexible Material
Metal Materials
Material
Material Brand

Capabilites

Rigid PCB
Layers1-100 Layers
MaterialFR4(TG130C),FR4(TG150C),FR4(TG170),Aluminum(5052,1.0w/mk)
Board Thickness0.2~4.0mm
Copper thickness0.5oz - 20oz(18um - 210um)
Inner Layer copper Thickness0.5oz - 6oz(18um - 70um)
Max Board size1200x700mm
Min Tracing/Spacing3.0mil/3.0mil
Min Annular Ring3mil
Min Drilling Hole diameter0.2mm(8mil),0.1mm(4mil)-laser drill
Solder maskGreen,green matte,Black,Black matte,White,Red,Yellow,Blue,Purple,Transparent
SilkscreenWhite,Black,Blue,Red,Yellow
Surface finishHASL with Lead,Free Lead HASL,ENIG,Immersion silver,Immrsion Tin,OSP,Hard gold
Surface/Hole plating thickness20-30um
Board thickness tolerance±0.1mm(±10%)
Board dimension tolerance±0.1mm ~ ±0.3mm
PTH hole tolerance±0.03
NPTH hole tolerance±0.02
Impedance tolerance±5% ~ ±10%
SMD Pitch0.2mm(8mil)
BGA Pitch0.2mm(8mil)
Aspect Ratio1:40
Chamfer of gold finger(Contact)20,30,45,60
Testing10V-250V,fly-probe or testing fixture
Others TechniquesGold fingers,Blind/Buried hole,peelable soldermask,Edge plating,Carbon mask,Kapton tape,Countersink/counterbore hole,Press fit hole,Via tented/covered with resin,Via plugged/filled with resin,Via in pad
FPC
Standard size250mm*1500mm
Line Width & Spacing0.08mm
Drill Hole0.1mm
Laser Hole0.05mm
Raw materialPI /FR4 /LCP/PET/STEEL
Solder mask bridge between dam0.1mm
TG130-170
Etching H/W/space0.02mm/0.1mm/0.1mm
testingOAI/ CMM/ Slice /microscope/E-test/ fly test
surface finishedENIG/Silver/copper/codon
Rigid-flex
Standard size250*500mm
Line width and spacing0.1mm
Lay count6 up
Min Drill hole and Laser hole tolearn10%
raw materialPI, LCP, FR4, STEEL, PET
solder mask0.1mm
TG130/170
Etching H/W/space0.03mm, .01mm, 0.1mm
testingOAI,CMM,SLICE,E-TEST,FLY-TEST,MIROCSCOPE
Material
RO4003C3.38±0.04 @10 GHz
RO4350B3.48±0.05 @10 GHz
RO4350B10.2±0.03 @10 GHz
Impedance Control
YesYes
Burried Vias
YesAny layer
Blind Vias
YesAny layer

Assembly Capabilities

Stencil Capabilities

Processing Technology: Laser Cutting

Thickness: 0.05 0.06 0.08 0.1 0.12  0.13 0.15 0.18 0.2 0.25 0.3 0.4 0.5 0.6 (Unit: mm)

Type: Top, Bottom, Top&Bottom on one panel

Non-framework or framework

Stencil Type: 304HTA

Minimum Aperture: >0.08mm

Cutting Tolerance: +0.003mm

Polishing: Electrolytic Polishing, Etching Polishing, Grinding Polishing

Electronic polishing: Optional

Step-down, Step-up stencil are also available.

Delivery Time: 24 Hrs to 2 Days (Depending on Order)

Industries Supported

  • Aerospace and Defense
  • Automotive
  • Commercial
  • Energy
  • Industrial
  • Lighting
  • Marine
  • Medical
  • Telecom

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