MultiTech Electron HK Ltd

(0 reviews)
  • Type: Manufacturer, Assembly, Design
  • China, Baoan District, Shenzhen
  • 86-760-88290182
  • 6F, xingzhongbao business building, fuyong road, fuyong town, bao'an district, shenzhen, China
MultiTech was established in 2006. The company specializes in high-density and high-tech PCB development, production and sales. Their PCB's are widely used in computers and peripherals, consumer electronics, LED, network communications, automotive electronics, industrial control and medical and other mainstream areas.  Our manufacturing capabilities range from PCB prototyping to large quantities. We are able to manufacture printed circuit board prototypes as an express service for up to 50 layers. With years of experience in the PCB industry, our production unit consists of 7,300 square meters in area with more than 420 workers, and a monthly output capacity of more than 10,000 sample projects with over 25,000 square meters of mass market production. As one of the leading suppliers in China, we are confident to offer more
Certifications : ISO 9001:2015, UL, RoHs

PCB Fabrication Capabilities Get PCB Fabrication Quote


Up to 50 Layers

Board Thickness

0.2 - 4.2 mm


4 - 15 Days

Board Dimensions

1200 x 600 mm

PCB Configuration

PCB Type


Material Brand

Manufacture Type

PCB Assembly Capabilities Get PCB Assembly Quote

Board Size

1200 x 600

Board Shape

Rectangular, Circular, Odd Shapes


Laser Cut Stainless Steel Stencil

Fine Pitch

0.2 mm

BGA Pitch

0.2 mm

Parts Procurement

Turnkey, Kitted

PCB Sides


Soldering Type

Package Type

File Format


Rigid PCB
Layers1-50 Layers
Board Thickness.0079
Copper thickness0.5oz - 12oz(18um - 210um)
Inner Layer copper Thickness0.5oz - 6oz(18um - 70um)
Max Board size1200x700mm
Min Tracing/Spacing3.0mil/3.0mil
Min Annular Ring3mil
Min Drilling Hole diameter0.2mm(8mil),0.1mm(4mil)-laser drill
Solder maskGreen,green matte,Black,Black matte,White,Red,Yellow,Blue,Purple
Surface finishHASL with Lead,Free Lead HASL,ENIG,Immersion silver,Immrsion Tin,OSP
Surface/Hole plating thickness20-30um
Board thickness tolerance±0.1mm(±10%)
Board dimension tolerance±0.1mm ~ ±0.3mm
PTH hole tolerance±0.03
NPTH hole tolerance±0.02
Impedance tolerance±5% ~ ±10%
SMD Pitch0.2mm(8mil)
BGA Pitch0.2mm(8mil)
Aspect Ratio1:40
Chamfer of gold finger(Contact)20,30,45,60
Testing10V-250V,fly-probe or testing fixture
Others TechniquesGold fingers,Blind/Buried hole,peelable soldermask,Edge plating,Carbon mask,Kapton tape,Countersink/counterbore hole,Press fit hole,Via tented/covered with resin,Via plugged/filled with resin,Via in pad

Customer Reviews Review This Company!

Web Analytics