HD330

The HD330 from ICT is a Solder Paste Jet Dispensing Machine that can be customized to meet the core requirements of AI, Internet of Things (IoT), CASE, blockchain, and other 5G technologies. It can support a PCB size from 50 x 70 mm to 250 x 330 mm and has a speed of 1500 mm/s. This dispensing machine consists of a linear motor drive control to move the nozzle over the PCB and precisely spray the dot (solder) on areas to be soldered. It has a positioning accuracy of ±3 µm and a repeatability of ±1 µm. This HD330 can measure any three points on the PCB to calculate the plane height and the needle height is automatically compensated based on the measured height data. It supports high-speed micro-spraying of high viscosity materials, automatic correction and compensation of chip cutting and welding errors. 

This solder paste dispensing machine has a load-type gantry structure that ensures high stability and accuracy of the machine during high-speed movement. It includes penetration monitoring function with upper and lower dual cameras to monitor the material penetration under flip chip in real-time throughout the process. This dispensing machine uses non-contact laser to detect substrate warpage up to 1 µm. It offers efficient image processing speed that reduces visual retrieval and inspection time of the PCB. This machine requires an AC supply of 200 V and consumes 20 A of current. It is available in an enclosure that measures 1300 x 1100 x 1380 mm.