Shenzhen Dihe Electronic Co., Ltd.

(0 reviews)
  • Type: Manufacturer, Assembly
  • China, Baoan District, ShenZhen City
  • +(86)-755 23313146
  • Room 806, HongHai GeBu Mansion, SongGang Street, Bao’An, Shenzhen, China
Shenzhen Dihe Electronic CO., LTD. Is a custom manufacturer of printed circuit boards (PCB). Our factory is located in DongGuan, China, we have passed UL, ISO9001, IATF16949, ISO14001 certification. The monthly capacity of PCB production is about 13,000SQM, our plant covers more than 5000SQM area and has about 150 employees. All of our boards are strictly made according to ROHS and IPC Class standard. Single and double sided, multi-layer, flexible, rigid-flex, metal core and lead free PCBs are available. We also offer special PCBs, such as high frequency boards, microwave/RF circuits, high speed pcb, HDI, blind and buried vias boards with special material like ROGERS, ARLON, TACONIC, MEGTRON, NELCO, NANYA, ISOLA. Our PCBs are widely used in aerospace, military devices, industrial control, communications, consumer electronics,...show more
Certifications : ISO 14001, ISO 9001, TS 16949, UL

PCB Fabrication Capabilities Get PCB Fabrication Quote

Layers

Up to 40 Layers

Board Thickness

0.2 - 5.0 mm

Timeline

2 - 16 Days

Board Dimensions

546 x 622 mm

PCB Assembly Capabilities Get PCB Assembly Quote

Time Line General

5 - 15 Days

Max Component Size

74 x 74 mm

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided

Assembly Type

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Capabilites

General
Copper thickness of outer layer1/3~10oz
Min. Circuit Width/ Spacing2/2mil
Min. Laser Holes0.1mm

Images

Certificates

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